🔆 Unleash the power of high-speed #OpticalNetworking with Lumentum's Integrated Coherent TROSA! 🔆 🔎 Discover the revolutionary capabilities of our 130+ GBaud Smart-TROSA, tailored for #cloud #datacenters driven by #AI/#ML applications. 🌐 This cutting-edge product combines efficiency with robust performance, featuring a flex-grid #laser, integrated Tx driver, and dual-polarization optical PIC—all in a compact package. 🔗 Ready to elevate your network? Explore how our smart-TROSA can transform your data handling: https://bit.ly/4bKWFxh #Lumentum #Photonics #Innovation
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Whitepaper: Scaling to 1,000-Layer 3D NAND in the AI Era Explore the future of #3D NAND Flash as the industry gears up to achieve unprecedented density and #performance. Discover the key #challenges and #innovations that are paving the way for scaling beyond 400 layers, including advanced etching technologies that are critical for this evolution. Read our whitepaper, in partnership with Lam Research, to gain #insights into the technologies driving the next wave of 3D NAND advancements and how they will shape the #AI era. The links to the whitepaper and the details about Lam Cryo™ 3.0 Cryogenic Etch Technology are in the comments below. #technology #research #compute #cloud #memory #3DNAND
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🧠 #Memory customers are looking different ways to scale capacity and lower bit cost. Apart from balancing bit growth and cost reduction, leveraging existing #tools, the way circuits that support the memory array are implemented, quicker production ramp at scale is crucial to implement AI at a greater scale. #2𝘋 𝘕𝘈𝘕𝘋 FLASH era required lower capital intensity and delivered higher cost reduction unlike #3𝘋 𝘕𝘈𝘕𝘋 FLASH which requires higher capital intensity and delivers lower cost reduction. However, #3𝘋 𝘕𝘈𝘕𝘋 FLASH has enabled higher bit growth rate as compared to 2D NAND FLASH. Although 3D NAND FLASH trades off cost reduction with bit growth, memory vendors will have to consider investments in tools sooner than later to meet the massive demand due to AI proliferation across end-market. "Lam Cryo 3.0" is a timely solution from Lam Research which utilizes #𝘤𝘳𝘺𝘰𝘨𝘦𝘯𝘪𝘤 𝘵𝘦𝘤𝘩𝘯𝘰𝘭𝘰𝘨𝘺 and innovation in #𝘦𝘵𝘤𝘩 process and further compliment’s #𝗡𝗔𝗡𝗗 𝗺𝗮𝗻𝘂𝗳𝗮𝗰𝘁𝘂𝗿𝗲𝗿’𝘀 efforts in maximizing bit growth density vital to meet #𝘈𝘐 demand. This technology offers an additional process window for improvement to NAND manufacturers’ and will help extend their #3D roadmap into the next decade. More details about the technology and how it will enable 3D NAND roadmap extension is presented in the whitepaper. Laura Bakken,Harmeet Singh, Barrett Finch
Whitepaper: Scaling to 1,000-Layer 3D NAND in the AI Era Explore the future of #3D NAND Flash as the industry gears up to achieve unprecedented density and #performance. Discover the key #challenges and #innovations that are paving the way for scaling beyond 400 layers, including advanced etching technologies that are critical for this evolution. Read our whitepaper, in partnership with Lam Research, to gain #insights into the technologies driving the next wave of 3D NAND advancements and how they will shape the #AI era. The links to the whitepaper and the details about Lam Cryo™ 3.0 Cryogenic Etch Technology are in the comments below. #technology #research #compute #cloud #memory #3DNAND
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European Director @ Counterpoint Technology Market Research - Delivering data and analytics to the Technology, Media and Telecommunications sector, professionals and companies.
Whitepaper: Scaling to 1,000-Layer 3D NAND in the AI Era Explore the future of hashtag #3D NAND Flash as the industry gears up to achieve unprecedented density and hashtag #performance. Discover the key hashtag #challenges and hashtag #innovations that are paving the way for scaling beyond 400 layers, including advanced etching technologies that are critical for this evolution. Read our whitepaper, in partnership with Lam Research, to gain hashtag #insights into the technologies driving the next wave of 3D NAND advancements and how they will shape the hashtag #AI era. The links to the whitepaper and the details about Lam Cryo™ 3.0 Cryogenic Etch Technology are in the comments below. hashtag #technology hashtag #research hashtag #compute hashtag #cloud hashtag #memory hashtag #3DNAND
Whitepaper: Scaling to 1,000-Layer 3D NAND in the AI Era Explore the future of #3D NAND Flash as the industry gears up to achieve unprecedented density and #performance. Discover the key #challenges and #innovations that are paving the way for scaling beyond 400 layers, including advanced etching technologies that are critical for this evolution. Read our whitepaper, in partnership with Lam Research, to gain #insights into the technologies driving the next wave of 3D NAND advancements and how they will shape the #AI era. The links to the whitepaper and the details about Lam Cryo™ 3.0 Cryogenic Etch Technology are in the comments below. #technology #research #compute #cloud #memory #3DNAND
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Clock Synchronisation Specialist | Expertise in PTP, NTP, PPS, SyncE, White Rabbit | GNSS Anti-Spoof & Anti-Jam Solutions | Serving Finance, Broadcast, Defence, Telecoms, IoT
🚀 Ready to Supercharge Your AI Workloads? The secret to unlocking unparalleled performance in AI datacenters might surprise you—it’s all about precision clock sync. 🕒 Discover how clock synchronization can optimize your GPUs, reduce latency, and drive efficiency like never before. And the best part? We’ve got the perfect solution with Timebeat’s low-profile Open Timecards. 🔥 Want to stay ahead in the AI race? Don’t miss this game-changing insight. ] Dive into the full blog now! (link in the comments) #AI #DataCenters #Innovation #GPUs #TechTrends #PerformanceOptimization
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Cignal AI recently released a deep dive into the Optical Circuit Switching (OCS) market that covers the current state of the art, the players, why it matters today, and forecasts for the future. As one of the long-term survivors in the OCS market featured in the report, with almost a quarter of a century of experience and technical leadership behind us, HUBER+SUHNER Polatis is supremely qualified to advise on the most suitable OCS for your application, whether it be spine layer replacement, AI cluster reconfiguration, data center disaggregation, test lab automation, network monitoring and cybersurveillance, or any number of other innovative uses identified by our customers over the years. We welcome the Cignal AI report and look forward to seeing them develop further insights into the OCS market for the wider benefit of our industry. You can read the report here: https://lnkd.in/ezhJXqdV
The Optical Circuit Switching Market - Cignal AI
cignal.ai
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So multi-tenancy for your #AI backend networks is the goal, but how do you get there? We're discussing the various strengths of VxLAN, ACL, and VRF - as well as how Broadcom switch silicon gives you the power to choose in our latest blog. Read more: https://bit.ly/48WD3V3 #AInetworking
Multi-tenancy for AI training network
broadcom.com
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The "long wire" problem in semiconductor System-on-Chip (SoC) design refers to the challenge of managing delays and signal integrity issues caused by lengthy interconnects between various components on the chip. As SoCs become increasingly complex with more functionality integrated onto a single chip, the distances signals need to travel can become significant, leading to increased propagation delays, power consumption, and potential signal degradation. Traditionally designers had employed techniques such as buffering, pipelining, and routing optimization to mitigate these issues and ensure reliable operation of the SoC at the expense of latency performance. The introduction of generative AI has pushed this issue even further, forcing strict latency requirements into systems. Traditional pipelining solutions are becoming prohibitive (even in source- synchronous applications) limiting performance and scalability of modern SoCs. See how Chronos is able to solve this issue... chronostech.com
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chronostech.com
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Join Lumentum's VP of Product Line Management, #Cloud and #Networking Marc Stiller, for a transformative Cignal AI #webinar on "Building Networks with #PluggableOptics" Dec 14th at 11 AM ET! Discover how pluggable coherent optics are reshaping network architectures. Key Takeaways: 🔍 Delve into the evolution and adoption of pluggable 400 and 800ZR modules. 🛠️ Learn how operators build efficient networks by integrating pluggable optics. 🔄 Understand the benefits of combining IPoDWDM, pluggable compact modular, and advanced hardware architectures. 🔮 Get a sneak peek into the future of pluggable coherent technology. Don't miss out, register today! 🔗: https://bit.ly/4a9ZlnR #TechInnovation #NetworkTransformation #CignalAI
🎟️ Register Today: Building Networks with Pluggable Optics
https://cignal.ai
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So multi-tenancy for your #AI backend networks is the goal, but how do you get there? We're discussing the various strengths of VxLAN, ACL, and VRF - as well as how Broadcom switch silicon gives you the power to choose in our latest blog. Read more: https://bit.ly/48WD3V3 #AInetworking
Multi-tenancy for AI training network
broadcom.com
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#SemiconductorRevolution: Advantest's ACS RTDI Unleashes Machine Learning Mastery! In a seismic shift for semiconductor manufacturing, Advantest has launched its ACS RTDI platform, a machine learning marvel set to redefine the efficiency and precision of semiconductor testing. Strategic Insights: 🔬 The ACS RTDI platform leverages machine learning to pinpoint problematic dies, streamlining the testing process and conserving resources. 🔬 By integrating advanced algorithms, it not only boosts chip yield but also enhances the overall business operations, from supply chain optimization to product innovation. 🔬 The role of machine learning is pivotal, employing techniques like deep network approximation and reinforcement learning to refine manufacturing. Market Implications: 💲 The platform's low-latency, secure data access, and system control tailored for semiconductor test operations position Advantest at the forefront of industry innovation. 💲 With a focus on reducing power consumption, the ACS RTDI platform contributes to the industry's sustainable technology initiatives, aligning with ESG investment trends. 💲 Tools like the model registry are essential for maximizing the benefits of machine learning models, ensuring optimal performance and usage. Investor's Perspective: 💡 Advantest's ACS RTDI platform signals a lucrative opportunity for investors keen on companies at the intersection of high-tech and sustainability. 💡 The platform's potential to revolutionize semiconductor manufacturing processes suggests a strong growth trajectory for Advantest, making it an attractive investment target. 💡 As machine learning continues to permeate various industries, investments in companies that are early adopters of such technologies may yield substantial returns. Advantest's ACS RTDI platform is not just a technological leap; it's a blueprint for the future of semiconductor manufacturing where efficiency, precision, and sustainability are inextricably linked. For investors and industry leaders, this is a clarion call to align with trailblazing innovations that promise to sculpt the market landscape. For a deeper dive into how machine learning is electrifying the semiconductor space, follow Market Unwinded - Your compass for navigating the tech terrain. Read More: https://lnkd.in/gzm8hMwX #Advantest #MachineLearning #SemiconductorIndustry #SustainableTech #InvestmentOpportunities #MarketUnwinded #Innovation #TechnologyTrends
Advantest's ACS RTDI: A Game-Changer in Semiconductor Manufacturing
marketunwinded.com
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