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#Article 📜 Manufacturing Process for Multilayer Dielectric Elastomer Transducers Based on Sheet-to-Sheet Lamination and Contactless Electrode Application by Tim Simon Krüger, Ozan Çabuk and Jürgen Maas 🔗 https://lnkd.in/gxnvjdY2 MDPI; Technische Universit��t Berlin #dielectricelastomertransducer #lamination #sheettosheet #manufacturing #fabrication #automation #Abstract Dielectric elastomer transducers (DETs) consist of thin elastomer films and compliant conductive electrodes on each side. Several DE-based systems, e.g., DE actuators, loudspeakers or sensors, have great potential in industrial applications. Different manufacturing processes for DE-based transducers have been realized so far. An alternative manufacturing process, based on sheet-to-sheet lamination of pre-fabricated elastomer films, appears promising for the manufacturing of large numbers of DETs, as, on the one hand, the commercially available elastomer films produced are characterized by homogeneous and reproducible properties and, on the other hand, the curing time during processing can be avoided. However, the handling of thin elastomer films and a controlled film transfer onto a surface is a challenge, as pre-stretch and wrinkles can easily occur. The presented sheet-to-sheet lamination mechanism facilitates controllable film handling well, whereby a high number of DE layers can be achieved. This paper focuses on the developed, automated film lamination of pre-cut film sheets and the electrode application via a jetting system, representing core components of the corresponding overall manufacturing process of DE laminates. The process realization on a laboratory scale is presented and manufactured DET specimens investigated for validation purposes.

Ultrasonic Spraying in Solar Cell Applications Ultrasonic spraying technology has emerged as a game-changer in the solar cell manufacturing industry, offering precision, efficiency, and cost-effectiveness. This advanced technique leverages high-frequency sound waves to create a fine mist of liquid, which can be uniformly deposited onto surfaces, making it ideal for various stages of solar cell production. What is Ultrasonic Spraying? Ultrasonic spraying involves the use of ultrasonic nozzles that convert electrical energy into mechanical vibrations. These vibrations produce a fine mist of droplets, typically in the range of micrometers. This mist can be precisely controlled and directed onto a substrate, ensuring a uniform and consistent coating. The key components of an ultrasonic spraying system include the ultrasonic generator, transducer, nozzle, and liquid delivery system. Applications in Solar Cell Manufacturing 1. Anti-Reflective Coatings (ARC): Anti-reflective coatings are essential in solar cells to minimize the reflection of sunlight and enhance light absorption. Ultrasonic spraying ensures a thin, uniform layer of ARC material is applied, optimizing the performance of the solar cell. 2. Passivation Layers: Passivation layers are crucial for reducing surface recombination of charge carriers, thus improving the efficiency of solar cells. Ultrasonic spraying provides a precise method to apply these layers, enhancing the overall quality and efficiency of the cells. 3. Conductive Inks: In the production of printed electronics for solar cells, conductive inks are used to form electrical contacts. Ultrasonic spraying allows for the controlled deposition of these inks, ensuring fine, conductive paths with minimal waste. 4. Perovskite Solar Cells: Perovskite solar cells have gained attention for their high efficiency and low production costs. Ultrasonic spraying is used to apply perovskite materials uniformly, which is critical for achieving high-performance cells. This method helps in forming smooth, defect-free layers that are essential for optimal cell operation. 5. Thin-Film Solar Cells: Thin-film solar cells require the deposition of various layers, including semiconductor materials and protective coatings. Ultrasonic spraying offers a versatile and precise way to apply these layers, contributing to the development of high-efficiency thin-film cells. #Precisionsurfacetreatmentequipment #solarcell #PerovskitSolarCells #ThinFilmSolarCells #MembraneElectrodeCoating #Preparationoftitaniumcationcoating #electrolyticwater

Curious about the magic behind 3D printing? 🤔 In my latest blog post, I delve into the basic understanding of vat photopolymerization. Click the link below to read the full blog post and know about vat photopolymerization! 😱 https://lnkd.in/dvj47aDE

In the electronics industry, cyanate ester substrates are essential for producing high-performance printed circuit boards (PCBs). Click here to learn more https://ow.ly/VjlO50S1Ura #pcb #directory #technical #article #community #post #resource #industry #insights #global #Cyanate #ester #resin #electronics #manufacturing #microwave #RF

#semiconductormaterials, 🌐 Wafer manufacturing materials, silicon materials, Monocrystalline silicon ingot: used for cutting into wafers. Polycrystalline silicon: used to produce monocrystalline silicon ingots. Dopants, phosphorus, boron, arsenic: used to change the conductive properties of silicon. Photolithographic material, photoresist: coated on a wafer to form a pattern. Mask: used for the projection of patterns during the photolithography process. Etching and cleaning chemicals, hydrogen fluoride, nitric acid, phosphoric acid: for wet etching. Deionized water: used to clean wafers. Deposition materials, silane, ammonia, silicon olefin: used in chemical vapor deposition (CVD). Target materials: used for physical vapor deposition (PVD), such as aluminum, titanium, and copper targets. Oxidation and diffusion materials, for purchase contact [email protected] Oxygen, nitrogen: used in oxidation and diffusion processes. Doping gas (such as phosphine): used for diffusion doping. Packaging and test materials, packaging materials, lead frames: used to connect chips to external circuits. Bonding wire: usually gold, aluminum, copper materials are used. Molding compound: used to protect chips, epoxy resin is commonly used. Packaging chemicals, solder: used to connect chips and lead frames, commonly used lead-tin alloy or lead-free solder. Flux: used to remove oxides and promote welding. Test materials, test probes: used for electrical testing. Test socket: used to fix the chip for testing. semiconductor consumables, Cleaning supplies, #wipes: used for clean room cleaning. Solvents (such as isopropyl alcohol): used to clean equipment and workpieces. Anti-static consumables, anti-static bracelets: used to prevent electrostatic damage. Anti-static floor mats: used to protect equipment Semiconductor device, Discrete devices, diodes, transistors: used in various electronic circuits. Field effect transistor, insulated gate bipolar transistor: used for power control. Integrated circuits, analog integrated circuits, digital integrated circuits: used in various electronic products. Sensors, temperature sensors, pressure sensors: used for environmental monitoring and control. Production process materials, masks, used to project patterns in the photolithography process. Ion implantation gas, borane, phosphorane: used in ion implantation process. Factory site equipment accessories, equipment accessories, pumps: for gas transfer and chemical handling. Filter: used for the purification of gases and liquids. Valves: used to control the flow of gases and liquids. Maintenance supplies, lubricants: for equipment maintenance. Cleaning brush: used for equipment cleaning. #Wafer transport box for safe transport and storage of wafers. packaging tube, , photoresist, are used to form patterns in the probe cards, semiconductor companies, semiconductor consumables, semiconductor suppliers, semiconductor wholesale manufacturers, purchasing contact WhatsApp +86 18988798089

#TBT Blown ion plasma and flame plasma are effective and repeatable treatment methods that take the guesswork out of electronics manufacturing bonding processes. Read this article from 2021 and learn more: https://brnw.ch/21wFwri #plasma #pretreatment #electronics #bonding Image: Enercon Industries.

The new RenAM 500S Flex machine has enabled Mott Corporation to reduce machine turnaround and setup times compared to previous AM technologies, while giving more confidence in the performance of printed parts.  www.renishaw.com Mott Corporation, based in Connecticut, USA, specialises in solving filtration and flow control engineering challenges in integrated components, point of use sub-assemblies, and integrated subsystems. It offers an extensive material selection for the most critical operating conditions, such as highly controlled bioreactor environments, semiconductor, chemical processing and refinement, and aerospace applications. It is trusted by many of the world's largest technical and performance brands. Historically, Mott Corporation produced components using three compaction methods: axial, isostatic, and rolling. However, there are some geometries these techniques are unable to produce. To expand its capabilities, Mott decided to investigate AM, identifying laser powde

Better, faster, solutions is what we do. Design and manufacturing options can include improved clarity, biocompatibility, embedded electrodes, connector flexibility, multiple dimensions (2D or 3D), channel width, and much more. See a real client journey below 👇 Part of the process required for the development for a client's #biodetection system required the #microfluidic mixing of sub-1ml liquid samples with a sequence of chemical reagents. Available off-the-shelf microfluidic mixers were too large to be efficient and required “daisy-chaining” together to allow for the correct sequence, resulting in a relatively huge dead-volume and consequential liquid losses. To optimize the sequential mixing process, a custom microfluidic chip was required. Existing methods for prototyping such as soft-lithography, or milling and bonding require outsourcing and in times of high demand could result in lead times of 6-8 weeks, and prices of up to £10,000 per iteration of design. Our unique approach produced a fully sealed test card in a matter of hours at a fraction of the cost, with concepts being tested on a lab-bench less than 24 hours after being designed, allowing for a true parallel-path iterative approach. #rapidprototyping #novelsolutions #mixing #3Dprinting #manifolds #biosensors #labonachip #PCB