The 61st DAC starts Monday, June 24 at Moscone West in San Francisco! There is still time to register and attend. Keynotes and SKYtalk presentations from Tenstorrent, Analog Devices, Intel Corporation, Keysight Technologies, CHIPS, Department of Commerce. www.DAC.com
DAC, The Chips to Systems Conference’s Post
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Recruiting IoT/IIoT, Security, Embedded, Network/Device, Cybersecurity, Automotive, ICS/SCADA, Mobile, Cloud, HPC/Supercomputing Talent
#Communications #Embedded CHANDLER, Ariz., May 30, 2024 — System designers face many barriers when adding Bluetooth® functionality to their products, from skill and resource limitations to budget constraints to time-to-market pressures to challenging performance and integration requirements. Microchip Technology (Nasdaq: MCHP) has expanded its Bluetooth Low Energy portfolio with 12 new products, aimed at providing designers with an extensive array … Read More → "Microchip Adds 12 Products to its Wireless Portfolio that Further Reduce Barriers to Bluetooth® Integration for Designers at Every Skill Level" https://lnkd.in/gsVyWxbC
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IEEE CASS Vice President - Education & Communications | Associate Professor in System-on-Circuit Physical Design, IoT
Do you work in the semiconductor industry? IEEE has many technical societies and communities that support IEEE members throughout the semiconductor value chain. Join the discussion! Learn about the ways that professionals working with semiconductors globally can navigate relevant IEEE resources and communities. Register for a free webinar entitled "Global Semiconductors: IEEE Resources and Communities for Those Working in the Semiconductor Industry" on 18 April at 1pm ET to learn more! Save your seat today! https://bit.ly/493bXeN
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NXP's MCX chips are targeting the intelligent edge. Learn how our microcontrollers are driving advancements in connectivity and intelligence in the link below 👇 #NXP #IntelligentEdge #Innovation
MCX is the new MCU
weare.nxp.com
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NXP's SN220 chip, integrating #NFC and an embedded secure element, has become the first to be certified by the Car Connectivity Consortium. Highly recommend this short news brief summarizing what this means for the future of digital car keys.
Discover NXP's Digital Car Key Solution Certified by CCC
weare.nxp.com
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Do you work in the semiconductor industry? IEEE has many technical societies and communities that support IEEE members throughout the semiconductor value chain. Join the discussion! Learn about the ways that professionals working with semiconductors globally can navigate relevant IEEE resources and communities. Register for a free webinar entitled "Global Semiconductors: IEEE Resources and Communities for Those Working in the Semiconductor Industry" on 18 April at 1pm ET to learn more! Save your seat today! https://bit.ly/493bXeN
Global Semiconductors: IEEE Resources and Communities for Those Working in the Semiconductor Industry
event.on24.com
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Launch of 5g Redcap module at MWC
#MWC24 Preview Welcome to join Fibocom’s new 5G #RedCap module #FM330 series launch conference in partnership with MediaTek during #MWC24! During the conference, together we will announce the world’s first #T300-based 5G RedCap Module FM330 series and 5G #Dongle solution built-in with FM330 series module. We have the great honor of having Evan Su, General Manager of Wireless Communications Business Unit at MediaTek to join us. The new FM330 series of 5G RedCap module is integrated with MediaTek’s T300 5G modem, which is the world's first 6nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap. By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency, and device battery life for industry customers. Location: Fibocom booth #5I33 in hall 5, Fira Gran Via Time: 14:30-15:30 PM on Feb.26th #Fibocom #MediaTek #RedCap #FM330series
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More to come
Just got fully authorized by NXP to replicate the MC68HC000/HC001 device. Coupled with our ability to assemble 68 PLCC packages at Rochester Electronics, LLC, we have overcome both a silicon and packaging EOL. Even the original test platform on which this was tested at Motorola is in-house at Rochester. Authorized extension of life for semiconductor products is what we do better than anyone. You can't make obsolescence obsolete, but you can partner with a real manufacturer who is authorized to extend semiconductor product life. Design, Assembly, Test....done in the US on this product. This product completes a legacy stack of processors from Motorola now at Rochester from the MC6800 through the MC68040 that are still going strong.
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The working principle of IC chips is popular, and interest enthusiasts come and meet me together: The basic working principle of IC chips is to use the characteristics of semiconductor materials to form a complex circuit system inside and package it into a whole. IC chips contain many tiny transistors and other devices, which can achieve digital circuits, analog circuits, memory and other functions.
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NXP's MCX chips are targeting the intelligent edge. Learn how our microcontrollers are driving advancements in connectivity and intelligence in the link below 👇 #NXP #IntelligentEdge #Innovation
MCX is the new MCU
weare.nxp.com
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Space Comm | Optical Comm | Quantum | AI | Semiconductors | Wireless | WiFi | DSP | Design | Manufacturing
"An LPO (Linear Pluggable Optics) solution offers considerable power savings for optical interconnect by removing the digital signal processing (DSP) function from the pluggable optical module. This architecture takes advantage of the capabilities in each segment of the link to form a power, cost, and latency optimized connection while maintaining the flexibility of pluggable optics. The focus of the LPO MSA [Multi-Source Agreement] is to specify module and network equipment level interoperability requirements that span both electrical and optical technologies. Starting at 100 Gb/s per lane, the LPO MSA will ensure multi-source solutions necessary for a broad ecosystem." ... "The LPO MSA plans to build on work started in OIF (CEI-112G-LINEAR-PAM4)." ... "The release of the first specifications are targeted Q3 ’24." Founding members : Accelink Technologies Co., Ltd. , AMD , Arista Networks , Broadcom , Cisco , Eoptolink Technology Inc., Ltd. , Hisense Group , InnoLight Technology , Intel Corporation , MACOM , NVIDIA , and Semtech." https://lnkd.in/gb-GkiTC https://lnkd.in/gTspK7eN
