Apex Semiconductor’s Post

Design teams are challenged by complexity. Team productivity and product performance are paramount. Explore how to streamline SoC design with advanced NoC IP and integration automation solutions in this article on Semiconductor Engineering. https://bit.ly/3XXBVyu #semiconductor #innovation #SystemOnChip #NetworkOnChip #Arteris

Today I was supposed to justify the area growth of the chip due to the DFD inclusion. I needed to justify the ROI of reduction in debug time/Post Silicon Validation(PSV), for the 5-7% of additional area of the chip. I came up with this example...The #Suez canal... A piece of precious land was sacrificed to connect the Mediterranean Sea and the Red sea. After it was built in 1869, people who travelled from Europe to Singapore did not have to go around the African continent, as shown in one of the figures below. This reduced the distance travelled by around 5000 miles!! Similarly the connection of #D4D and #PSV. The 5-7% sacrifice in the chip area could save an SOC days and months of debug work saving millions of dollars for a company. Please let me know if you like the analogy or have a better one.

🚀 The System-on-Chip (SoC) market is entering a period of rapid growth, driven by innovations in chiplet integration, advanced packaging, and AI-powered designs. With applications ranging from data centers to automotive, SoCs are reshaping the semiconductor industry. Our latest report highlights key trends in SoC design, the critical role of Silicon IP, and emerging opportunities across various sectors. Discover how these advancements are poised to fuel the market’s growth through 2025. Access the full report here 👉 https://bit.ly/3BcvGO7 #SystemOnChip #SemiconductorIndustry #ChipletTechnology #AdvancedPackaging #AIIntegration

The joint work between Intel Corporation and Bluewaves Mobility Innovation Inc. (BMI), an emerging Ontario startup, reinforces our commitment to expanding Open Radio Access Network (O-RAN) networks, providing next-generation radio units that promote a more connected world with energy efficiency. In the new Era of connectivity in which demands become increasingly complex, Intel seeks to boost the potential of O-RAN, which offer total interoperability with hardware standardization. BMI will integrate Intel's Agilex FPGA products into its next generation of radio designs, leveraging the full potential of the accelerated performance offered.See more: https://lnkd.in/d5iHdPzC #IAmIntel #OneIntel #ORAN #BMI #Canada

A few weeks ago, the Semiconductor Industry Association (SIA) released a set of recommendations to aid in the success of the National Semiconductor Technology Center (NSTC). 🛡 The NSTC, a $5 billion public-private consortium, is central to the CHIPS R&D program, aiming to advance semiconductor technology and strengthen the domestic semiconductor workforce for economic competitiveness and security. These recommendations reflect an industry consensus to effectively guide the establishment and operation of the NSTC. 📖Read and Download the full report 🔗 https://lnkd.in/eGcNrjth 🔔Stay updated with the latest developments and follow our page Start With WCPGW for more information! #semiconductor #hardwaresecurity #chip #security #technology #startwithwcpgw #wcpgw #infosec

📢 Intel Corporation accelerates the development of #GaN integrated circuits 🎯 KnowMade highlights Intel’s recent announcements in the latest issue of its GaN newsletter: https://lnkd.in/emeYFiqn 👉 #IEDM 2022: Major advancement in power switches and RF transistors on 300-mm GaN-in-Si technology 👉 #IEDM 2023: A new GaN power IC for 48V and below, #DrGaN, using layer transfer technology to monolithically integrate a CMOS driver with GaN power switches on a 300mm GaN-on-Si platform 👉 A new record for #RF transistor was published in April 2023 using a 300-mm GaN MOS-HEMT process with integrated Si CMOS. 👉 Intel has resumed its IP activities for GaN electronics in 2022-2023, with the strongest progression in #patent filings observed in Europe. 💡 In the RF GaN patent landscape 2023, #Intel stands as one of the best-established IP players for GaN-on-Si epiwafers, and as an undisputable IP leader for GaN-on-Si devices, far ahead of its main IP challengers, including MACOM and TSMC. Han Wui T. Marko Radosavljevic Paul Fischer Stephen Goodnick Ky Merrill #galliumnitride #powerelectronics #radiofrequency 

The Global Memristor Market was valued at USD 287.2 Million in 2023 and is projected to reach a market size of USD 2228.02 Million by the end of 2030. Over the forecast period of 2024-2030, the market is projected to grow at a CAGR of 34%. More Details @ https://lnkd.in/dcfyd9HQ Key Players in Memristor Market are : Hewlett Packard Enterprise Intel Corporation Samsung Electronics SK hynix IBM Micron Technology CrossBar Inc. Knowm Inc. Panasonic Western Digital Rambus Toshiba Corporation Fujitsu Taiwan Semiconductor Adesto Technologies #MemristorMarket #Memristor #vmrrresearch #marketanalysis

As industrial requirements for performance, security and connectivity become increasingly important, companies are investing in their own private 5G networks. Check out this inspiring collaboration between NXP Semiconductors and Compal, and discover how their combined expertise leads to power, size and cost optimized Integrated Small Cells. #5GInnovation #connectivity

Global Ethernet PHY Chip Market was valued at USD 9.4 Billion in 2022 and is anticipated to project robust growth in the forecast period with a CAGR of 8.4% through 2028. The Global Ethernet PHY Chip Market is currently experiencing significant growth driven by the escalating demand for high-performance networking solutions across diverse industries. Ethernet PHY (Physical Layer) chips, which facilitate seamless data transmission between devices within a network, have become indispensable components in modern communication systems. Explore Global Market and Key Players Insights: https://lnkd.in/g8D2FaPc 🔑 Key Market Players are Broadcom Inc. Intel Corporation Marvell Technology Group Ltd. Microchip Technology Inc. Texas Instruments Incorporated Realtek Semiconductor Corp. Qualcomm Technologies, Inc. NXP Semiconductors N.V. Maxim Integrated Analog Devices, Inc.

🌐 Silicom Denmark & Intel Introduce N6010 & N6011 SmartNICs for Telecom Networks We're thrilled to unveil the collaboration between Silicom Denmark and #Intel, presenting the N6010 & N6011 SmartNICs. Fueled by Intel Agilex #FPGA N6000-PL, these cards address operational challenges with proven efficiency, seamless integration, and cost reduction, as endorsed by diverse end users. In response to the dynamic landscape of #network protocols, this collaboration pioneers a hardware-based time synchronization solution. Silicom's expertise in Precision Time Protocol (PTP) combines seamlessly with Intel's Agilex FPGA, promising unparalleled timing accuracy and adaptability for virtualized environments. #Telecom professionals working with vRAN, O-RAN, and UPF #technologies will find a tailored solution in N6010 & N6011 #SmartNICs, exclusively powered by Intel Agilex FPGA. Catch a firsthand look at this solution at the MWC conference in Barcelona this week. Visit Intel booth (Hall 3 Stand 3E31) for in-depth details and discussions on shaping the future of network synchronization. #silicom #Intel #mwc24 Intel Network & Edge https://lnkd.in/dAj3c4tw