Apex Semiconductor’s Post

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Apex Semiconductor will be speaking at DesignCon 2024 on Thursday, February 1st, at the Santa Clara Convention Center. Please come and learn from our technical experts on how an ecosystem came together to successfully design a three-chiplet based SmartNIC platform with high-speed D2D interfaces and many high throughput I/O's. Our experts will also share with the audience the signal integrity signoff methodology, using Cadence design and analysis tools, for the three high-speed interfaces on this platform. #chiplets #packagingsolutions #d2d #bow #bunchofwires #dietodie #pcie #ethernet #smartnetworking #apexsemi #designcon2024

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Edward Herniak

Director of Engineering - Photodiode Reliability Testing

2mo

Looking forward to learning from the experts at DesignCon 2024—sounds like an insightful session on SmartNIC platforms! Just completed a large order for the US government for testing photodiodes. Would be great to connect since we are in the same industry. Sent you an invite.

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