Managing Legacy In Automotive https://lnkd.in/g7uXEmxc As vehicle technology evolves, carmakers must decide which technologies move forward and what gets left behind. Part 1 of experts roundtable. By Ann Mutschler. With Wayne Lyons, senior director for the automotive market at AMD; Judy Curran, CTO for automotive at Ansys; Amit Sharma, product management director for Cadence Design Systems’s Compute Solutions Group; Adiel Bahrouch, director of business development for silicon IP at Rambus; and Marc Serughetti, vice president, product management and applications engineering at Synopsys Inc. #automotive #ADAS #autonomousvehicles #ISO26262 #SDV
Semiconductor Engineering
Online Audio and Video Media
Silicon Valley, CA 86,739 followers
Deep insights for the tech industry
About us
Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations and standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors, as well as insights into the market dynamics that make it all possible. The goal of this site is to provide useful, independently developed content through targeted monthly newsletters, weekly updates, timely news alerts, videos, independent research, and a portal that serves as a forum for exchanging ideas and answering questions.
- Website
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http://semiengineering.com
External link for Semiconductor Engineering
- Industry
- Online Audio and Video Media
- Company size
- 2-10 employees
- Headquarters
- Silicon Valley, CA
- Type
- Self-Owned
- Founded
- 2013
Locations
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Primary
Silicon Valley, CA, US
Employees at Semiconductor Engineering
Updates
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New technical papers recently added to Semiconductor Engineering’s library https://lnkd.in/g46rxsjx #lowpower #semiconductor #HardwareSecruity #2Dmaterials #tunnelFETs #ferroelectric #neuromorphiccomputing Rice University University of California, Berkeley Georgia Institute of Technology TSMC Intel Corporation Harvard University University of Chicago Argonne National Laboratory Stanford University The University of Texas at Austin Politecnico di Milano STMicroelectronics Global TCAD Solutions, Igor Sikorsky Kyiv Polytechnic Institute, INSA Lyon - Institut National des Sciences Appliquées de Lyon NaMLab Ramamoorthy Ramesh Sayeef Salahuddin Suman Datta Anish Saxena Walter W., and Alexandros Daglis Ankit Kumar, Lin Xu, Arnab Pal, Kunjesh Agashiwala Chloe Isabella T. Haihui Pu Junhong Chen Murat Can Işık Jonathan Naoukin I. Can DIKMEN, PhD. Sara Ghomi Christian Martella Mischa Thesberg Tetiana Obukhova Damien Deleruyelle
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Latest news: Auto chiplet consortium; critical IC materials risk; TIMs; more nuke plants for AI; Foxconn in Mexico; ML in auto MCUs; 3nm PHY chiplet; chip health monitoring; AI test. https://lnkd.in/gcqNpAEG #chiplets #semiconductor #automotive imec Arm ASE Global Tenstorrent Valeo Center for Strategic and International Studies (CSIS) Gracelin Baskaran, PhD Meredith Schwartz Dow Carbice NVIDIA Foxconn GlobalWafers Co., Ltd. Yole Group McKinsey & Company TSMC Edwards Vacuum Eliyan Corporation proteanTecs Keysight Technologies Cadence Design Systems Infineon Technologies AMD Driver PhotonDelta Analog Devices Texas Instruments MIPI Alliance Atomera Oak Ridge National Laboratory Martí Checa Nualart Rama Vasudevan Natcast.org D2S, Inc. University of Florida Nitin Varshney SiliconAuto India MediaTek Tata Technologies Altair
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Engineering teams are turning to the cloud to process and store increasing amounts of EDA data, but while the compute resources in hyperscale data centers are virtually unlimited, the move can add costs, slow access to data, and raise new concerns about sustainability. https://lnkd.in/gHuuYeYp By Adam Kovac. #EDA #datastorage #sustainability #datacenter #AImodels Rob Knoth Dean Drako Jim Schultz Bill Mullen Tim Thornton Arm Cadence Design Systems IC Manage Synopsys Inc Ansys
The Cost Of EDA Data Storage And Processing Efficiency
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Data Routing In Heterogeneous Chip Designs https://lnkd.in/dXEx5mup This recent SemiEngineering Tech Talk discusses challenges and solutions for working with multiple chiplets. #chiplets #advancedpackaging #heterogeneousintegration #NoC #networkonchip #signalintegrity #semiconductor Ronen Perets Cadence Design Systems
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Semiconductor Engineering reposted this
SemiEngineering's latest eBook: Memory Fundamentals For Engineers https://lnkd.in/gmQkUWPb Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what’s changing, which memories are successful and which ones might be in the future; and what are the limitations of each memory type. 73 pages. By Bryon Moyer, SE Technology Editor, plus numerous articles by Semiconductor Engineering staff writers. #DRAM #SRAM #HBM #CXL #3DNAND #RRAM #computermemory #semiconductor #VLSI
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The discovery of ferroelectricity in materials that are compatible with integrated circuit manufacturing has sparked a wave of interest in ferroelectric devices. By Katherine Derbyshire. https://lnkd.in/gAjEX6DE #FeFETs #ferroelectric #DRAM #HZO #FeRAM Minhyun Jung KAIST Chinese Academy of Sciences Beijing Institute of Technology Fudan University Guan Feng
Preparing For Ferroelectric Devices
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Special Report: Nations vie for a piece of the semiconductor pie with offers of cash, subsidies, tax breaks, and other approaches. First of a series of articles. By Elizabeth Allan. https://lnkd.in/gbKVjXNu #semiconductor #semiconductormanufacturing #funding U.S. Department of Commerce Semiconductor Research Corporation (SRC) GlobalFoundries ASM ASML TSMC Bosch Infineon Technologies Todd Younkin Intel Corporation Amkor Technology, Inc. International Technology Security and Innovation (ITSI) Ajit Manocha SEMI NVIDIA #GaN Natcast.org Purdue University Arm CMC Microsystems Chips Joint Undertaking India Semiconductor Mission National Quantum Mission INDIAai #CHIPSAct
Government Chip Funding Spreads Globally
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What comes after HBM, and why that matters for future designs. SemiEngineering's latest Tech Talk. The usual method of migrating to the next process node to cram more features onto a piece of silicon no longer works. It’s too expensive, and too limited for most applications. The path forward is now heterogeneous chiplets targeted at specific markets, and while logic will continue to scale, other features are being separated out into chiplets developed using different process technologies. This already is happening with high-bandwidth memory, and the next target is I/O. Letizia Giuliano, vice president of IP product marketing and management at Alphawave Semi, talks about the challenges of developing and integrating chiplets, where the likely problems arise, and how this differs from a homogeneous SoC. #chiplets #heterogeneousintegration #semiconductor https://lnkd.in/gNBPwqbp
Working With Chiplets
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Chip Industry Technical Paper Roundup https://lnkd.in/gj48JUhb New technical papers recently added to Semiconductor Engineering’s library #semiconductor #KANs #edgecomputing #flexibleelectronics #RISCV #inferencing #3DIC #SRAM #analog #verification #memristors #RF Georgia Institute of Technology TSMC National Tsing Hua University Pragmatic Harvard University IBM Research Cornell University Polish Academy of Sciences imec Infineon Technologies Technion - Israel Institute of Technology National Institute of Standards and Technology (NIST) Wei-Hsing Huang Jianwei Jia Yuyao Kong Emre Ozer Jedrzej Kufel Shvetank Prakash Rathinakumar Appuswamy, Michael DeBole Brian Taba Len van Deurzen Eungkyun (EK) Kim Anna F. Sudipta Das Bhawana Kumari Siva Satyendra Sahoo Hansa Mohanty, Deepak Gadde Tanay Patni , Rishona Daniels, Shahar Kvatinsky Jacob Pawlik Tomasz Karpisz, PhD Nicholas Derimow Sarah Evans