We are pleased to welcome Ita Brennan and Mark Fields to our board of directors. Read more about the deep global leadership experience that Ita and Mark bring to the board. https://bit.ly/3XqHg0L
Lam Research
Semiconductor Manufacturing
Fremont, CA 314,095 followers
Driving semiconductor breakthroughs that define the next generation. Trusted partner of the world’s leading chipmakers.
About us
Lam Research Corp. (NASDAQ:LRCX) At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration. The impact we have on the world is made possible by focusing on our people. We recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value. We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities. Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible. Ready to help define the future of technology? Join us: www.lamresearch.com/careers
- Website
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http://www.lamresearch.com
External link for Lam Research
- Industry
- Semiconductor Manufacturing
- Company size
- 10,001+ employees
- Headquarters
- Fremont, CA
- Type
- Public Company
- Founded
- 1980
- Specialties
- Semiconductor Manufacturing Equipment, Global Services, Fabrication Technology, Chipmaker Solutions, Microprocessors, and Wafer Processing
Locations
Employees at Lam Research
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Kaushik Chattopadhyay
Director, Engineering, Lam Research
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Kevin Chow
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Tony Hsu
Manage software team onshore and offshore to develop software on and around Lam equipment to enhance productivity. Provide vision of intelligent…
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Suresh Shrawagi
Executive - Supply Chain and Global Contract Manufacturing
Updates
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Our Group VP and GM of Etch Product Group Harmeet Singh joined Counterpoint Research’s Neil Shah to shed light on how the industry pushes the envelope of memory density and performance. Watch the episode to learn how our latest advancements in etch and deposition scale 3D NAND for the next generation of #AI technology. ⬇️ https://bit.ly/4cPrP6B
Lam Research’s Cryogenic Etching – Scaling 3D NAND for AI
https://www.youtube.com/
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We’re on a mission to drive semiconductor breakthroughs that define the next-generation, one solution at a time. In a podcast with The_TechArena’s Allyson Klein, our Senior Director of Advanced Packaging Chee Ping Lee discusses the critical technology enabling 3D chip stacking for HBM and AI chips. Listen in. 🎙️ https://bit.ly/3YZz48M
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Process engineering is critical to the manufacturing of new chips, but manual development is costly and complex. To accelerate innovation and decrease costs, we conducted a controlled study using a virtual process game to compare the performance of human engineers and computer algorithms with #AI. Here’s what we found. https://bit.ly/3MI4nxH
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The #AI revolution is not just a possibility—it’s inevitable. From our Global VP and GM of Etch Product Group Harmeet Singh, hear how we enable 3D NAND, increasing storage density and capacity, and boosting data output speeds to meet AI demands. https://bit.ly/3yCkBVv
The Path to 1,000-Layer 3D NAND
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Did you catch the latest TECHnalysis Talk featuring our Global VP and GM of Etch Product Group Harmeet Singh? Harmeet discusses our cutting-edge Cryo 3.0 technology, our ambitious path to achieving 1,000-layer NAND, and more with host Bob O'Donnell. Watch now! 👇
The move toward Generative AI workloads is driving a number of second order impacts that have critical implications for key technologies, including NAND memory-based storage devices. To address these issues, companies like Lam Research are working to dramatically increase the capacity of the core 3D NAND chips with new technologies like their Cryo 3.0 etching tools. I'll be chatting about this with Lam Research's Global Vice President and General Manager of Etch Product Group Harmeet Singh on my next TECHnalysis Talks podcast this Thursday at 10 am PT/1 pm ET. Check it out!
TECHnalysis Talks: Lam Research and the Path to 1,000 Layer NAND
www.linkedin.com
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While source/drain contact (CT) recess has the potential to reduce metal gate parasitic capacitance and improve electrical performance in logic devices, it can increase resistance. In a recent study, we used SEMulator3D® virtual DOEs to predict resistance and capacitance—here's what we learned. https://bit.ly/4cA2PA0
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Time to test your knowledge on our 2023 ESG report! Which "mode" saw expansion in 2023 on our new and existing tools in the field, potentially leading to a 40% reduction in energy consumption? 2023 ESG report: https://bit.ly/41qv3Zr
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From smartphones to electric toothbrushes, the parts found within most end-market consumer devices trace back to the tools and services we provide. Learn about the cutting-edge tools we supply in the memory, foundry, and logic markets. https://bit.ly/3ST44Dr
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Our Corporate VP Aaron Fellis joined EE Times | Electronic Engineering Times and embedded.com’s Chiplets virtual event to explore advanced processes and equipment technologies for #AI chip packaging. If you missed it, watch the full event on-demand now to learn how these innovations and methodologies are shaping the future of AI chip technology. Aaron’s session is 5th on the agenda. https://bit.ly/4crydAX
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