🌊 Taiwan, a beautiful island surrounded by vibrant waters, is home to a diverse marine ecosystem. Sadly, this natural heritage faces threats from growing waste accumulation on the ocean floor and beaches. Since 2021, ASE Global has taken a stand with our marine conservation program. We've mobilized over 150 divers, conducted more than 140 cleanups, and restored 540 coral colonies to help protect and revitalize ocean ecosystems. 🌍💧 In collaboration with the ASE Environmental Protection and Sustainability Foundation, the corporate communications team has produced a short film to share our journey and achievements. Highlighting ASE’s innovative marine conservation and environmental stewardship, the film has captivated international judges with its creative portrayal of our sustainability efforts and social impact. We are incredibly proud that our film has won Gold at the PwC Sustainability Impact Awards! 🎉🌟 This award not only honors sustainable innovation in Taiwan but also aligns with the vision of the Cannes Lions International Festival of Creativity, celebrating storytelling that drives impact, in alignment with the UN SDGs. #Sustainability #MarineConservation #SocialImpact #ASE
About us
ASE (Advanced Semiconductor Engineering, Inc), a member of ASE Technology Holdings (NYSE:ASX) is one of the world's largest providers of outsourced semiconductor manufacturing services in assembly and test (OSAT), and, a leading provider of electronic manufacturing services (EMS) through its sister company, USI. Addressing global proliferation of sophisticated electronics geared towards improving lifestyle and efficiency, ASE is strategically integrating synergies between its well established OSAT and EMS business units. ASE is at the forefront of a new class of EMS that delivers modularized, miniaturized ICs with system-level precision to enable high-performance and highly integrated devices. As a result, ASE is truly bridging the gap between silicon and system makers. From traditional semiconductor players to players innovating applications within IoT, wearables, automotive, AR/VR, connectivity and many more, success within an increasingly dynamic market hinges on creating and sustaining highly productive manufacturing partnerships. ASE has proven ability to collaborate closely with customers, to understand markets and create value propositions, and to deliver advanced packaging and SiP solutions to meet growth momentum across a broad range of end markets. Manufacturing facilities are strategically located within key electronics manufacturing hubs, including Taiwan, China, Korea, Japan, Malaysia, and Singapore. Serving customers across the global electronics ecosystem, regional sales offices are located in Sunnyvale (USA), Brussels (Europe), Hsinchu (Taiwan), Shanghai/Beijing (China), Shenzhen (China), Yokohama (Japan), Gyeonggi-do (Korea) and Singapore. For more, please visit: aseglobal.com. Also, please follow ASE on Twitter: @aseglobal.
- Website
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https://www.aseglobal.com
External link for ASE Global
- Industry
- Semiconductor Manufacturing
- Company size
- 10,001+ employees
- Headquarters
- Kaohsiung, Taiwan
- Type
- Public Company
- Specialties
- Substrate design and supply, Wafer level packaging, Fanout, Fiip chip, System-in-Package, Wire bond, TSV-interposer integration, Wafer probe & bump, MEMS & sensor solutions, Embedded die technology, Final test and design, Electronic manufacturing services, VIPack, and Advanced Packaging
Locations
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Primary
No. 26, Chin 3rd Road
Nantze Export Processing Zone
Kaohsiung, Taiwan, TW
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1255 E. Arques Ave
Sunnyvale, CA 94085, US
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550, Chung-Hwa Road
Section 1
Chung-Li, 320, TW
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Waterloo Office Park - Building M
Drève Richelle, 161, Box 23
Waterloo, B-1410, BE
Employees at ASE Global
Updates
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Hello GSA Global Semiconductor Alliance You’ve come a long way! A throwback to the mid-2000s, when ASE first won a coveted seat representing the OSAT sector, on the Board of directors of the FSA (before it evolved to become GSA). We’ve never looked back since, and have maintained a very good relationship with the GSA global team over the years. The charismatic leadership of Jodi Shelton and the dedicated support of the GSA member community have contributed in no small measure to the meteoric growth of the semiconductor industry. Through the era of the internet, smart phones, cloud and now #AI, our industry has never stopped transforming and innovating. This year, ASE was a Platinum sponsor at the APEF in #Taipei. The calibre of the speakers at the forum was impressive but what was truly inspiring was the increased representation of women on the agenda including Claire Wang | Debra Bell | Hsiao-Lu Denise Lee | Mei May Soo | Vanessa Lee Although #AI and its impact took centerstage at the forum, the richness and depth of the day’s presentations as well as panel discussions were deeply insightful and engaging. Once again, hats off to the amazing GSA team Power Chi Crystal Wang Shungo Saito for the organizing of a successful event. Happy 30th anniversary to GSA Global and Happy 20th anniversary to GSA #Asia Pacific To more good years to come #Taiwan #onetrillion2030 #chiplets #heterogeneousintegration #semiconductors #edgecomputing #machinelearning #GenAI #WomeninTech
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+5
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It was a tremendous honor to host a large delegation of distinguished guests from Jalisco, Mexico at ASE’s US Headquarters in #Sunnyvale this week. Leading the contingent was Governor Enrique Alfaro Ramírez, accompanied by Governor elect, Pablo Lemus Navarro who will move into office 2024 – 2030. Their joint presence and visit to the #SiliconValley is testament to their alignment - and commitment to growing the semiconductor industry in Jalisco. Governor Alfaro spoke passionately about how his administration has supported and partnered with leading #semiconductor companies to build up a thriving manufacturing hub in #Guadalajara, widely known as Mexico’s Silicon Valley. One of his economic ministers, Xavier Orendain De Obeso shared his perspective on the ongoing strategic investments in technology, infrastructure, and talent to support a growing industry, while Alfonso Pompa Padilla, Secretary of Ministry of Science, Technology and Innovation, and Juan Carlos Flores M., Secretary of Education, deeply echoed these sentiments. Governor elect Lemus shared his excitement and vision for the next six years and beyond, while newly elected Secretary of Economic Development Cindy Blanco Ochoa spoke ardently about her motivation and drive to build out the semiconductor and OSAT ecosystem, with ASE leading the way. Thank you to ASE’s Ingu Yin Chang for sharing ASE's vision and to Ou Li for sharing some personal experiences from her visits to the region, referencing the amazing #engineering talent - and fabulous food. We much appreciate the support from our sister companies, ISE Labs | ASE and Universal Scientific Industrial Co., Ltd. Represented by Jeff Thompson and Andrew Lee respectively, both underscored the importance of Guadalajara within the North American semiconductor value chain. Sincere thanks to Dina Grijalva and Nestor Eduardo Garcia Romero for all the help and support. We look forward to our continued partnership. Gracias - and safe travels home to Gobierno del Estado de Jalisco! #AI #Chiplets #HeterogenerousIntegration #advancedpackaging #VIPack
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+1
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🌐 Key Takeaways from the HI & AI Panel at IMPACT 2024 At the #IEEE EPS Panel during #IMPACT2024, ASE Global VP CP Hung moderated an insightful discussion with industry leaders Glenn Daves from NXP Semiconductors, Chih-Ming Hung from MediaTek, Chris Scanlan from IMAPS, and William Chen from IEEE-EPS on the future of #semiconductor design and manufacturing. The panelists emphasized the need for standardization in packaging tools and materials to overcome industry challenges. Collaboration across the supply chain was emphasized as essential to aligning goals and advancing technologies. Interdisciplinary skills were also highlighted as critical for today’s engineers, who must combine deep expertise with broad, cross-functional knowledge. The transformative potential of #AI was a major theme. From optimizing chip designs to streamlining complex packaging processes, AI is set to reshape the industry. Additionally, hybrid bonding was identified as a breakthrough technology poised to redefine chip interconnectivity. 💡 In closing, CP Hung emphasized the pivotal role of HI and AI in driving packaging innovations. Thank you to the panelists and attendees for these valuable insights! #IMPACT2024 #IEEE #AI #HI
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+3
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The #semiconductor industry is immersed in discovery, debate, and development around #chiplets and their role in the most sophisticated applications the world has ever seen. #Advancedpackaging is pivotal. Thanks to Dr. Kay Essig and Nicole Tien for sharing ASE's take. #heterogeneousintegration #VIPack #FOCoS #Bridge #HBM #ASIC #GPU #AI #HPC #datacenter #automotive #sustainability
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A picture is worth a thousand words, and here is a sampling of some significant moments captured at the recent International Microelectronics Assembly and Packaging Society (IMAPS) conference, #IMAPS2024, which took place in #Boston. Between excellent keynotes including Zero ASIC's Beth Keser, Ph.D. who walked us though the complexities of 'The #Chiplet Revolution' and dynamic panel discussions including E. Jan Vardaman's delve into 'RDL packaging for #HighPerformance Applications' featuring ASE's Ou Li, the show put the spotlight squarely on innovation and ecosystem, alike. Technology is moving quickly. Chiplets are here, and focus continues to shift towards the standards, source codes, ADKs, #EDA tools, #advancedpackaging, and the cross-industry alignment that is needed for mainstream permeation. Well done to Sheng Li (李晟)for once again representing ASE so well, just a few days before his wedding day - and congratulations! Huge thanks to the brilliant IMAPS team for all the help and support - Brian S., Kelly O'Brien, Kristie Bowman, Becky Rowland, and Adrienne Gerard. #VIPack #powerSIP #heterogeneousintegration #AI #HPC #datacenter #automotive #power #energy #efficiency #sustainability #semiconductor
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+5
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Did someone say, "Show me your FOCoS-Bridge?" Thanks to ASE's Mark Gerber for giving hundreds of #FOCoSBridge demos last week at #OCPSummit2024 hosted by the Open Compute Project Foundation, and supported by ASE's William Chen, Patricia MacLeod, and Tilson Chung. Congrats on a fantastic summit, George Tchaparian, Cliff Grossner Ph.D., Dirk Van Slyke and Kali Burdette, CMP et al., we were thrilled to be there! #advancedpackaging #heterogeneousintegration #chiplets #HBM #AI #datacenter #HPC #cooling #thermal #power #powerSiP #VIPack #fanout #FOCOS #FOCOSBridge #innovationvillage
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High energy and excitement as an audience of 6.7K+ settles into the keynote session at the Open Compute Project Foundation #OCPsummit2024 in San Jose this morning. Looking forward to hearing from OCP’s George Tchaparian and Cliff Grossner Ph.D., as well as featured speakers from AMD, Meta, NVIDIA, Google, Intel Corporation, GEICO, Microsoft, and others. Bring it on! ASE will be represented in the Innovation Village by Patricia MacLeod, William Chen, Calvin Cheung and Mark Gerber, so please drop by if you’re here. #Datacenter #AI #energyefficiency #cooling #sustainability #advancedpackaging #VIPack
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ASE Celebrates the Groundbreaking of the K28 Plant in Kaohsiung! Today, ASE marked the groundbreaking of our new K28 plant in Kaohsiung, designed with a focus on three key pillars: #AutomatedFactory, #SmartManufacturing, and #LowCarbonGreenBuilding. Set for completion in 2026, the K28 plant will enhance advanced packaging capabilities, including #CoWoS, to support both wafer production and final testing, while generating 900 new job opportunities! Interested candidates can explore career opportunities by visiting our website at https://lnkd.in/g3rfphGT. 💼💡 ---------------------------------------- 日月光為深耕前瞻技術及深化封測產業發展,今日於高雄市大社區舉行新廠K28動土典禮,以 #自動化工廠 #智慧製造 #低碳綠建築 三個構面規劃,預計2026年完工! K28將滿足先進封裝製程(CoWoS)的晶圓、終端測試需求,創造900個就業機會! 歡迎南高屏地區研發及科技人才👩🏻🎓👨🎓加入,一起搭上科技創新的列車🚄。 更多新聞資訊請見→https://lnkd.in/gvrCdBPB #ASE #Kaohsiung #newfactory #advancedpackaging #automation #smartmanufacturing #greenbuilding #日月光 #高雄廠K28開工動土 #南部半導體S廊帶
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The executive panel at the recent Global Semiconductor Alliance #USEF2024 was fully loaded with industry leaders - and expert opinion. Moderator Sanjay Jha led a dynamic discussion, by first delving into how #AI has impacted ecosystem business thus far. ASE’s Tien Wu described how AI is much bigger than we can imagine. The impact is yet to be realized, but while approaching business and capex decisions, history has taught us that we must consider how pervasive AI might be, and its impact to humanity, commerce, efficiency, and indeed to the global economy? Thanks for the brilliant perspectives, Sandra Rivera of Altera, Rene Haas of Arm, and Anirudh Devgan of Cadence Design Systems. And to GSA's Jodi Shelton, Kole Giles, and Shungo Saito for consistently bringing together the brightest minds in the industry. There was subsequent conversation on #semiconductorindustry realignment to overcome the challenges of Moore’s law, accommodate new architectures, and pave the way for supply chain flexibility related to #heterogeneousintegration and #chiplets. Tien Wu referred to hardware as the new bottleneck, specifically mentioning power, thermal, and bandwidth challenges, while citing silicon photonics as a mainstream way forward once ecosystem evolution, technology innovation, and business economics align. There was broad panelist consensus that together we must address the systemic complexity facing our industry so that AI can safely transform our lives in the most positive and efficient ways. #efficiency #gamechanging #cybersecurity #advancedpackaging #VIPack