Aug 26, 2014 · So, in this paper, the temperature dependent elastic model of underfill is adopted to analyze the structure stress of InSb IRFPAs. Besides, the ...
Around the glass transition temperature, underfill shows viscoelasticity, yet, far below it, which shows apparently temperature dependent mechanical properties.
Simulation results show that the stress maximum in InSb chip is strongly determined by arrays format and increases with array scale; yet, the stressmaximum ...
Abstract: To improve the reliability of InSb IRFPAs, underfill has usually been filled between InSb chip and Si ROIC. Around the glass transition ...
To improve the reliability of InSb IRFPAs, underfill has usually been filled between InSb chip and Si ROIC. Around the glass transition temperature ...
Dec 1, 2024 · Around the glass transition temperature, underfill shows viscoelasticity, yet, far below it, which shows apparently temperature dependent ...
蔡佳勳（2015）。The Analysis and Simulation of the Thermal Stress Induced by Through-Silicon Via (TSV) with Round Corner Structure〔碩士論文，國立臺灣大學〕。
Analysis on Structural Stress of 64 × 64 InSb IRFPAs with Temperature Dependent Elastic Underfill. L. Zhang, W. Tian, Q. Meng, M. Sun, N. Li, and Z. Lei.
Oct 22, 2024 · Analysis on Structural Stress of 64 × 64 InSb IRFPAs with Temperature Dependent Elastic Underfill. August 2014 · Journal of Sensors. Liwen ...
the structure stress of 64×64 InSb IRFPAs in a short time period, here, a two-step method is employed, basing the above simulated results, the typical ...