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Low-voltage limitations of deep-sub-100-nm CMOS LSIs: view of memory designers

Published: 11 March 2007 Publication History

Abstract

Deep-sub-100-nm CMOS LSIs using a bulk CMOS device and a planar double-gate FD-SOI device are compared in terms of the low-voltage limitation of RAM cells, sense amplifiers, and logic gates. The limitation strongly depends on the ever-larger VT variation, especially in SRAM cells and logic gates, and is improved by the FD-SOI. Consequently, two possible LSIs are predicted to coexist in the deep-sub-100-nm generation: High-VDD bulk CMOS LSIs for low-cost low-standby-current applications, and low-VDD FD-SOI LSIs for low-power applications.

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  1. Low-voltage limitations of deep-sub-100-nm CMOS LSIs: view of memory designers

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    cover image ACM Conferences
    GLSVLSI '07: Proceedings of the 17th ACM Great Lakes symposium on VLSI
    March 2007
    626 pages
    ISBN:9781595936059
    DOI:10.1145/1228784
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    Publication History

    Published: 11 March 2007

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    Author Tags

    1. DRAM
    2. FD-SOI
    3. SRAM
    4. VT variation
    5. bulk
    6. deep-sub-100-nm CMOS LSIs
    7. leakage
    8. logic gate
    9. minimum VDD
    10. speed variation

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    GLSVLSI07: Great Lakes Symposium on VLSI 2007
    March 11 - 13, 2007
    Stresa-Lago Maggiore, Italy

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