research-article

Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure

Authors:

Shailja Pandey,

Preeti Ranjan PandaAuthors Info & Claims

ACM Transactions on Embedded Computing Systems, Volume 22, Issue 6

Article No.: 104, Pages 1 - 27

https://doi.org/10.1145/3624581

Published: 09 November 2023 Publication History

Abstract

Modern high-performance and high-bandwidth three-dimensional (3D) memories are characterized by frequent heating. Prior art suggests turning off hot channels and migrating data to the background DDR memory, incurring significant performance and energy overheads. We propose three Dynamic Thermal Management (DTM) approaches for 3D memories, reducing these overheads. The first approach, Rotating-channel Low-power-state-based DTM (RL-DTM), minimizes the energy overheads by avoiding data migration. RL-DTM places 3D memory channels into low power states instead of turning them off. Since data accesses are disallowed during low power state, RL-DTM balances each channel’s low-power-state duration. The second approach, Masked rotating-channel Low-power-state-based DTM (ML-DTM), is a fine-grained policy that minimizes the energy-delay product (EDP) and improves the performance of RL-DTM by considering the channel access rate. The third strategy, Partial channel closure and ML-DTM, minimizes performance overheads of existing channel-level turn-off-based policies by closing a channel only partially and integrating ML-DTM, reducing the number of channels being turned off. We evaluate the proposed DTM policies using various mixes of SPEC benchmarks and multi-threaded workloads and observe them to significantly improve performance, energy, and EDP over state-of-the-art approaches for different 3D memory architectures.

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Cited By

Pandey SPanda P(2024)NeuroTAP: Thermal and Memory Access Pattern-Aware Data Mapping on 3D DRAM for Maximizing DNN PerformanceACM Transactions on Embedded Computing Systems10.1145/367717823:6(1-30)Online publication date: 11-Sep-2024
https://dl.acm.org/doi/10.1145/3677178

Index Terms

Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure
1. Hardware

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cover image ACM Transactions on Embedded Computing Systems

ACM Transactions on Embedded Computing Systems Volume 22, Issue 6

November 2023

428 pages

ISSN:1539-9087

EISSN:1558-3465

DOI:10.1145/3632298

Editor:
Tulika Mitra
National University of Singapore, Singapore

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ACM Journals for the Design of Smart and Connected Systems

Publication History

Published: 09 November 2023

Online AM: 05 October 2023

Accepted: 27 August 2023

Revised: 27 July 2023

Received: 31 March 2023

Published in TECS Volume 22, Issue 6

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Cited By

Pandey SPanda P(2024)NeuroTAP: Thermal and Memory Access Pattern-Aware Data Mapping on 3D DRAM for Maximizing DNN PerformanceACM Transactions on Embedded Computing Systems10.1145/367717823:6(1-30)Online publication date: 11-Sep-2024
https://dl.acm.org/doi/10.1145/3677178

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