research-article

Embedding statistical tests for on-chip dynamic voltage and temperature monitoring

Authors:

Lionel Vincent,

Philippe Maurine,

Suzanne Lesecq,

Edith BeignéAuthors Info & Claims

DAC '12: Proceedings of the 49th Annual Design Automation Conference

Pages 994 - 999

https://doi.org/10.1145/2228360.2228539

Published: 03 June 2012 Publication History

Abstract

All mobile applications require high performances with very long battery life. The speed and power consumption trade-off clearly appears as a prominent challenge to optimize the overall energy efficiency. In Multiprocessor System-On-Chip architectures, the trade-off is usually achieved by dynamically adapting the supply voltage and the operating frequency of a processor cluster or of each processor at fine grain. This requires monitoring accurately, on-chip and at runtime, the supply voltage and temperature across the die. Within this context, this paper introduces a method to estimate, from on-chip measurements, using embedded statistical tests, the supply voltage and temperature of small die area using low-cost digital sensors featuring a set of ring oscillators solely. The results obtained, considering a 32nm process, demonstrate the efficiency of the proposed method. Indeed, voltage and temperature measurement errors are kept, in average, below 5mV and 7°C, respectively.

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Cited By

Sharma DKirischian L(2021)A Method for Run-Time Prediction of On-Chip Thermal Conditions in Dynamically Reconfigurable SOPCsInternational Journal of Reconfigurable Computing10.1155/2021/88187882021Online publication date: 7-Jan-2021
https://dl.acm.org/doi/10.1155/2021/8818788
Chairat SBeigne EMiro-Panades IBelleville M(2017)Ultra Low Energy FDSOI Asynchronous Reconfiguration Network for Adaptive CircuitsJournal of Low Power Electronics and Applications10.3390/jlpea70200117:2(11)Online publication date: 11-May-2017
https://doi.org/10.3390/jlpea7020011
Mercati PPaterna FBartolini ABenini LRosing T(2017)WARM: Workload-Aware Reliability Management in Linux/AndroidIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2016.261150136:9(1557-1570)Online publication date: 1-Sep-2017
https://dl.acm.org/doi/10.1109/TCAD.2016.2611501
Show More Cited By

Index Terms

Embedding statistical tests for on-chip dynamic voltage and temperature monitoring
1. Hardware
  1. Emerging technologies
  2. Very large scale integration design

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Published In

cover image ACM Conferences

DAC '12: Proceedings of the 49th Annual Design Automation Conference

June 2012

1357 pages

ISBN:9781450311991

DOI:10.1145/2228360

General Chair:
Patrick Groeneveld
Magma Design Automation, Inc., San Jose, CA
,
Program Chairs:
Donatella Sciuto
Politecnico di Milano, Milano, Italy
,
Soha Hassoun
Tufts Univ., Medford, MA

Copyright © 2012 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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EDAC: Electronic Design Automation Consortium
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CEDA

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SIGBED: ACM Special Interest Group on Embedded Systems

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 03 June 2012

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DAC '12

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EDAC
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DAC '12: The 49th Annual Design Automation Conference 2012

June 3 - 7, 2012

California, San Francisco

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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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62nd ACM/IEEE Design Automation Conference

June 22 - 26, 2025

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Cited By

Sharma DKirischian L(2021)A Method for Run-Time Prediction of On-Chip Thermal Conditions in Dynamically Reconfigurable SOPCsInternational Journal of Reconfigurable Computing10.1155/2021/88187882021Online publication date: 7-Jan-2021
https://dl.acm.org/doi/10.1155/2021/8818788
Chairat SBeigne EMiro-Panades IBelleville M(2017)Ultra Low Energy FDSOI Asynchronous Reconfiguration Network for Adaptive CircuitsJournal of Low Power Electronics and Applications10.3390/jlpea70200117:2(11)Online publication date: 11-May-2017
https://doi.org/10.3390/jlpea7020011
Mercati PPaterna FBartolini ABenini LRosing T(2017)WARM: Workload-Aware Reliability Management in Linux/AndroidIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2016.261150136:9(1557-1570)Online publication date: 1-Sep-2017
https://dl.acm.org/doi/10.1109/TCAD.2016.2611501
Puschini DRodas JBeigne EAltieri MLesecq S(2016)Body Bias usage in UTBB FDSOI designs: A parametric exploration approachSolid-State Electronics10.1016/j.sse.2015.11.019117(138-145)Online publication date: Mar-2016
https://doi.org/10.1016/j.sse.2015.11.019
Gaillardon PBeigne ELesecq SMicheli G(2015)A Survey on Low-Power Techniques with Emerging TechnologiesACM Journal on Emerging Technologies in Computing Systems10.1145/271456612:2(1-26)Online publication date: 2-Sep-2015
https://dl.acm.org/doi/10.1145/2714566
Mercati PBartolini APaterna FRosing TBenini LFettweis GNebel W(2014)A Linux-governor based dynamic reliability manager for Android mobile devicesProceedings of the conference on Design, Automation & Test in Europe10.5555/2616606.2616734(1-4)Online publication date: 24-Mar-2014
https://dl.acm.org/doi/10.5555/2616606.2616734
Akgul YPuschini DLesecq SBeigné EMiro-Panades IBenoit PTorres L(2014)Power management through DVFS and dynamic body biasing in FD-SOI circuitsProceedings of the 51st Annual Design Automation Conference10.1145/2593069.2593185(1-6)Online publication date: 1-Jun-2014
https://dl.acm.org/doi/10.1145/2593069.2593185
Akgul YPuschini DLesecq SBeigne EMiro-Panades IBenoit PTorres L(2014)Power management through DVFS and dynamic body biasing in FD-SOI circuits2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)10.1109/DAC.2014.6881510(1-6)Online publication date: Jun-2014
https://doi.org/10.1109/DAC.2014.6881510
Beigne EValentian AGiraud BThomas OBenoist TThonnart YBernard SMoritz GBilloint OManeglia YFlatresse PNoel JAbouzeid FPelloux-Prayer BGrover AClerc SRoche PLe Coz JEngels SWilson RMacii E(2013)Ultra-wide voltage range designs in fully-depleted silicon-on-insulator FETsProceedings of the Conference on Design, Automation and Test in Europe10.5555/2485288.2485440(613-618)Online publication date: 18-Mar-2013
https://dl.acm.org/doi/10.5555/2485288.2485440
Belleville MThomas OValentian AClermidy F(2013)Designing digital circuits with nano-scale devices: Challenges and opportunitiesSolid-State Electronics10.1016/j.sse.2013.02.03084(38-45)Online publication date: Jun-2013
https://doi.org/10.1016/j.sse.2013.02.030
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