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🌟 We’ve just published OMRON’s Integrated Report 2024！ 🌟 Discover OMRON’s value creation story, where our business strategy and sustainability strategy are fully integrated 💡. We’ve also taken on the challenge of Impact-Weighted Accounts, converting the effects of our initiatives in the areas of "Environment," "Products," and "Employment" into monetary values, highlighting the positive impact we’re making on society 🌍. ▼ Check out the full Integrated Report https://lnkd.in/eaPtMEs #OMRON #ShapingtheFuture2030 #Sustainability #Automation　#IntegratedReport2024 #IntegratedReporting #ImpactWeightedAccounts

“BGA for Generative AI boards” We will introduce the inspection issues and OMRON's solutions for BGA, the most important part of high-performance data processing in Generative AI. High-performance data processing requires high energy, and semiconductor ICs can become very hot. BGAs are undergoing "major" changes　such as becoming larger for managing this high-peformance data processing and heat dissipation. In addition to designers mounting many more capacitors and heat sinks on the bottom of the PCBS. When heat is applied, the warping of parts and boards increases. Bumps (balls) peel off or “Head-In-Pillows (HIPs)” are likely to occur if they do not melt completely. If this defect were to be overlooked, it can possibly peel off in data centers where heat is constantly applied due to huge amounts of data communications, leading to Serious Incidents such as communication failures. If you are facing such issues, please feel free to contact OMRON. For inquiries in English： https://lnkd.in/eDcaS5zp 日本語でのお問い合わせはこちら（For inquiries in Japanese）: https://lnkd.in/gbYQxhzG

🌍 Towards a Sustainable Future! 🌱 OMRON accelerates CO2 reduction through green manufacturing technology ⚙️🌿. Malaysian production base achieves an annual reduction of 515 tons 🎉, contributing to the global environment 🌏✨. #OMRON #ShapingtheFuture2030 #Sustainability #GreenPartManufacturing https://lnkd.in/g-QCieFe

Collaboration contributes towards solving climate change🌎 As climate change intensifies 🌍🔥, the risks and damages from extreme weather events have become increasingly critical for businesses 🌪️📉. In response, OMRON Device & Module Solutions Company collaborated with Weathernews Inc. 🌦️ to develop an advanced weather IoT sensor 📡 designed to mitigate these risks. #OMRON #ClimateAction #WeatherIoT #RiskManagement #BusinessResilience #IoTSolutions #ClimateTech #SustainableFuture https://lnkd.in/gyUPk39x

Our data utilization service "i-BELT" is a co-creation service to address and solve your challenges by utilizing, analyzing, and visualizing the data collected on the manufacturing floor 🏭, and by providing feedback to the control 🔄. Conducting hearings on visions for the ideal factory 💡, we find enhancements and improvements based on manufacturing floor data 📊, and provide tailor-made guidance with effective scenarios to each customer 🤝. For more information on i-BELT service, please click the following link： https://lnkd.in/gwz7Ymvz #OMRON #Automation #iBELT #SmartFactory

“BGA for Generative AI boards” We will introduce the inspection issues and OMRON's solutions for BGA, the most important part of high-performance data processing in Generative AI. High-performance data processing requires high energy, and semiconductor ICs can become very hot. BGAs are undergoing "major" changes　such as becoming larger for managing this high-peformance data processing and heat dissipation. In addition to designers mounting many more capacitors and heat sinks on the bottom of the PCBS. When heat is applied, the warping of parts and boards increases. Bumps (balls) peel off or “Head-In-Pillows (HIPs)” are likely to occur if they do not melt completely. If this defect were to be overlooked, it can possibly peel off in data centers where heat is constantly applied due to huge amounts of data communications, leading to Serious Incidents such as communication failures. If you are facing such issues,please feel free to contact OMRON. For inquiries in English： https://lnkd.in/eDcaS5zp For inquiries in Japanese：https://lnkd.in/gbYQxhzG

🌍 OMRON Exhibits at "COP29 Japan Pavilion Virtual Exhibition" 🖥️ Introducing Solutions for Achieving Carbon Neutrality 🌱 🌏 COP29 Azerbaijan Japan Pavilion is an exhibition and event booth hosted by the Ministry of the Environment during #COP29 to promote technologies, products, and services that support the realization of "Net Zero by 2050" 🕊️, Japan's long-term goal for combating climate change 🌱, and decarbonization and climate change adaptation around the world 🌐. 📈 In its long-term vision, Shaping the Future 2030 (SF2030), OMRON has set carbon neutrality as one of the 3 social issues that OMRON must address 🌍. OMRON is working to achieve carbon neutrality through the provision of its own products and services ⚙️ and to promote carbon neutrality at its own sites 🏢. In this exhibition, OMRON's solutions that contribute to the realization of carbon neutrality will be introduced through videos 🎥 of actual manufacturing sites 🏭. https://lnkd.in/gPqVmaCZ #OMRON #ShapingtheFuture2030 #SF2030 #COP29 #NetZero #CarbonNeutrality #decarbonization #ClimateChange

For 31 years, OMRON Dalian has been dedicated to empowering individuals with disabilities. 🌟 Located in Jinpu New District, our parts production workshop thrives on the belief that everyone deserves equal opportunities. 🛠️ At OMRON, we believe that true innovation comes from diverse perspectives. 🌍 Over the years, we have built a supportive environment where every employee can thrive, regardless of physical challenges. 🌱 Under its long term vision, #SF2030, #OMRON aims to empower every employee to create societal value through their professional endeavors and achieve a collective vision of societal prosperity and individual fulfillment. 🚀 #Diversity #Inclusion https://lnkd.in/g4PvXa-v

“OMRON's 3D CT X-ray inspection solution for quality issues in Data-Center PCB boards using Generative AI.” The spread of the internet has greatly changed the way we access information and communicate. The internet has become indispensable to our society and life. Generative AI is having a huge impact on all fields as the next innovation in the internet. With future technological evolution, the impact of Generative AI on business efficiency, medicine, education, creatives, etc. will become even greater. Generative AI can generate content from data. Therefore, it is necessary to process much larger amounts of data at higher speeds than ever before. In data centers, various changes are required to manage this higher processing, such as power consumption, high temperature countermeasures, storage, and environmental considerations. Major changes in design and componentry in the electronic circuit boards (PCBs) used in Generative AI data centers, are occurring which at the same time become “Major Inspection Challenges”. OMRON, which builds the VT-X750 3D CT X-ray inspection system, with one of the world's largest market shares, is seeing a sharp increase in our customers` inspection requests. In a total of 3 articles, we will introduce the “Trends in inspection issues” on electronic boards caused by product changes and “3D　CT　X-ray inspection Solutions by OMRON”. Case 1: “BGA for Generative AI boards” In the first article, We will introduce the inspection issues and OMRON's solutions for BGA, the most important part of high-performance data processing in Generative AI. High-performance data processing requires high energy, and semiconductor ICs can become very hot. BGAs are undergoing "major" changes such as becoming larger for managing this high-peformance data processing and heat dissipation. In addition to designers mounting many more capacitors and heat sinks on the bottom of the PCBS. When heat is applied, the warping of parts and boards increases. Bumps (balls) peel off or “Head-In-Pillows (HIPs)” are likely to occur if they do not melt completely. If this defect were to be overlooked, it can possibly peel off in data centers where heat is constantly applied due to huge amounts of data communications, leading to Serious Incidents such as communication failures. If you are facing such issues, please feel free to contact OMRON. For inquiries in English： https://lnkd.in/eDcaS5zp 日本語でのお問い合わせ（For inquiries in Japanese）：https://lnkd.in/gbYQxhzG - Preview of the 2nd episode (2) Introducing the inspection issues and solutions for "Press Fit connectors" that are rapidly increasing due to the processing of huge amounts of data. #OMRON #GenerativeAI #Server #DataCenter #CT #Inspection #CTInspection #Xray #XrayInspection #BGA #GPU #CPU #TPU #VT_X750 #IAB

Brillopak and OMRON Collaborate to Transform Food Manufacturing Automation with UniPAKer P160 The evolving demands of food manufacturing, coupled with workforce shortages, are driving companies to seek efficient automation solutions. In response, Brillopak has partnered with OMRON to deliver the UniPAKer P160, a fully automated pick-and-pack machine. This innovation enables manufacturers to pack multiple products across various SKUs and packaging environments, catering specifically to the high precision required by supermarkets. #OMRON #Transform #FoodManufacturing https://lnkd.in/gE6DS4BH