Edvin Cetegen

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Papers by Edvin Cetegen

Controlling Underfill on Die in Multi-chip Heterogenous Integration with Large Die Height Delta

IEEE Transactions on Components, Packaging and Manufacturing Technology

Gece Soğutmasında Binaların Isıl Performansı

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For All Versions of Constant Heat Flux

Force Fed Microchannel High Heat Flux Cooling Utilizing Microgrooved Surfaces

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Heat Transfer Analysis of Microgrooved Evaporator and Condenser Surfaces Utilized in a High Heat Flux Two-Phase Flow Loop

Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B, 2007

This paper investigates the heat transfer and pressure drop analysis of micro grooved surfaces ut... more This paper investigates the heat transfer and pressure drop analysis of micro grooved surfaces utilized in evaporators and condensers of a two-phase flow cooling loop. These devices utilize the vapor-liquid phase change to transfer large amounts of heat, and they offer substantially higher heat flux performance with lower pumping power than most liquid cooling technologies. Microgrooved surfaces, combined with force-fed evaporation and condensation technology discussed in this paper yield high heat transfer coefficients with low pressure drops. Our most recent results, aiming to test the limits of the technology, demonstrated dissipation of almost 1kW/cm2 from silicon electronics using HFE 7100 as the working fluid. In a compact two phase system, the heat generated by the electronic components can be absorbed by microgrooved evaporators and rejected through the microgrooved surface condensers to liquid cooled slots with high heat transfer coefficients and low pressure drops on the r...

Multi Objective Optimization of a Force Fed Microchannel Heat Sink

ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 2009

An approximation assisted optimization (AAO) method was used to optimize the geometry and flow pa... more An approximation assisted optimization (AAO) method was used to optimize the geometry and flow parameters of a Force Fed Microchannel Heat Sink (FFMHS). Numerical simulation solvers were combined with the chosen optimization scheme to obtain the design points. A Kriging meta-modeling was applied to optimize the problem using Multi Objective Genetic Algorithm. The optimum results were compared with optimum designs of a well known traditional microchannel heat sink for a 1 × 1 cm2 base heat transfer area. It is demonstrated that for a constant pumping power, force fed microchannel heat design sink can achieve 65% more heat transfer on average. For a given thermal performance, the pressure drops associated with FFMHS represent only a fraction of the pumping power required by a traditional microchannel heat sink.

Force-Fed Microchannels for High Flux Cooling Applications

SpringerBriefs in Applied Sciences and Technology, 2012

ABSTRACT In this chapter, the working principles of force-fed microchannel (micro-grooved) heat e... more ABSTRACT In this chapter, the working principles of force-fed microchannel (micro-grooved) heat exchangers (FFMHX) in single-phase and two-phase heat transfer modes are defined and the associated benefits of using these systems are highlighted. The literature on FFMHX is reviewed, and important conclusions are summarized. The main benefits of optimally designed next generation force-fed heat transfer (FFHT) configurations are the short, parallel microchannel network system and equal flow distribution among the channels through careful manifold design. The collective benefits include substantially higher available heat/mass transfer surface area, precise flow distribution among the channels, creation of thin film cooling in microchannels such that the thin film component dominates the flow regime, and low to moderate pressure drops while achieving record-high heat/mass transfer coefficients. The information presented in this chapter includes experimental evaluation of the thermal performance of FFMHXs in two-phase heat transfer mode using refrigerant R-245fa. Two distinct heat transfer trends were observed. At high hydraulic diameter, high mass flux, and high heat flux, the heat transfer coefficients had a slowly increasing trend with increase in heat flux and outlet quality. At low hydraulic diameters, low mass flux, and low heat flux, the heat transfer coefficients experience a bell-shaped behavior with a sharp increase at low vapor qualities until they reach the maximum peak point. Most recent research has focused on increasing the vapor quality at the exit of the evaporator for energy efficiency and optimum system performance. It was demonstrated that the tested FFMHX heat sink configuration can cool a heat flux of q″base = 1.23kW/cm2 with a superheat of Δ T sat = 56.2°C and pressure drop of only Δ P = 60.3 kPa. The results clearly suggest that under optimum design conditions, FFMHXs have the proven potential to achieve substantially higher heat transfer coefficients with low to moderate pressure drops, and substantially less working fluid in circulation, and thus substantial compaction (weight/volume reductions), improved energy efficiency, and reduced capital and operational cost. When compared to the state-of-the-art thermal management/conventional systems.

Studies on Condensation of Refrigerants in a High Aspect Ratio Microchannel and in a Novel Micro-Groove Surface Heat Exchanger: Development of Micro-Condensers in Compact Two Phase Cooling Systems

ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 2007

Three different refrigerants, R134a, R245fa and HFE7100 were analyzed as working fluids for two-p... more Three different refrigerants, R134a, R245fa and HFE7100 were analyzed as working fluids for two-phase cooling of high heat flux electronics in a 0.7 mm hydraulic diameter 190 mm long high aspect ratio minichannel and in a newly developed micro-groove surface condenser. The latter comprised of a micro-groove surface with rectangular grooves of 84 μm in hydraulic diameter with an aspect ratio of 10.6 and headers that directed the refrigerant flow into the grooves. It was concluded that in the minichannel R245fa provides higher heat transfer coefficients compared to R134a with a significantly higher pressure drop. The saturation temperature drop in the same channel created a significant temperature drop for HFE7100 that make the application of such minichannels for cross-flow condensers with this fluid unpractical. The microgroove surface condenser provided significantly higher heat transfer coefficients compared to the minichannel condenser. The pressure drop in the micro-groove surfa...

Emerging Applications of Microchannels

SpringerBriefs in Applied Sciences and Technology, 2012

Microchannel heat exchangers have applications in several important and diverse fields including:... more Microchannel heat exchangers have applications in several important and diverse fields including: aerospace; automotive; bioengineering; cooling of gas turbine blades, power and process industries; refrigeration and air conditioning; infrared detectors and powerful laser mirrors and superconductors; microelectronics; and thermal control of film deposition. The advantages of microchannel heat exchangers include high volumetric heat flux, compactness for space-critical applications, robust design, effective flow distribution, and modest pressure drops. This chapter will cover selected industrial examples for microchannel heat exchangers, microchannel heat pipes, and microchannel heat plates.

Fundamentals of Microchannels

SpringerBriefs in Applied Sciences and Technology, 2012

The growing demand for product miniaturization in all industrial sectors, coupled with global com... more The growing demand for product miniaturization in all industrial sectors, coupled with global competition for more reliable, faster, and cost-effective products, has led to many new challenges for design and operation of thermal management systems. The rapid increase in the number of transistors on microchips, with increased functionality/power and consequently higher heat fluxes, is one such great challenge in the electronics packaging industry. Microchannel heat and mass exchanger technologies are finding new applications in diverse industries and emerging as a promising solution to game changing technologies in the way we design and operate next-generation, high performance thermal management systems. The discussion in this chapter will deal with fundamentals of microchannels. We begin by introducing the history, technical background, classification, advantages, and disadvantages of microchannels. Fabrication methods (conventional technology and modern technology) for microchannels are considered next. Finally, correlations of pressure drop and heat transfer coefficient for single-phase and phase-change flows are presented for a variety of internal flow conditions.

Heat Transfer Analysis of Force Fed Evaporation on Microgrooved Surfaces

ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels, 2008

Force Fed Evaporation (FFE) technique was parametrically analyzed using refrigerant R245fa over a... more Force Fed Evaporation (FFE) technique was parametrically analyzed using refrigerant R245fa over a 1cm2 microgrooved surface. The heat transfer tests were performed so as to isolate the effects of heat flux, mass flux, and saturation pressure and to identify the dominant heat transfer mechanism in FFE. In particular, results were obtained for selected values of mass flux with various heat flux levels, as well as for selected values of heat flux with various saturation pressure levels. Tests were performed for heat fluxes up to 562W/cm2 and qualities up to 29%. For these conditions, it was found that heat transfer is mainly dependent on heat flux, and not on mass flux or quality. This further implies that the dominant heat transfer mechanism is nucleate boiling.

Next Generation Microchannel Heat Exchangers

SpringerBriefs in Applied Sciences and Technology, 2013

The first € price and the £ and $ price are net prices, subject to local VAT. Prices indicated wi... more The first € price and the £ and $ price are net prices, subject to local VAT. Prices indicated with * include VAT for books; the €(D) includes 7% for Germany, the €(A) includes 10% for Austria. Prices indicated with ** include VAT for electronic products; 19% for Germany, 20% for Austria. All prices exclusive of carriage charges. Prices and other details are subject to change without notice. All errors and omissions excepted. M.M. Ohadi, K. Choo, S. Dessiatoun, E. Cetegen Next Generation Microchannel Heat Exchangers

Force-fed evaporation and condensation utilizing advanced micro-structured surfaces and micro-channels

Microelectronics Journal, 2008

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Force Fed Boiling and Condensation for High Heat Flux Applications

This paper presents heat transfer characteristics of an innovative, self-contained two phase cool... more This paper presents heat transfer characteristics of an innovative, self-contained two phase cooling method that utilizes force-fed boiling (FFB) and force-fed condensation (FFC) techniques over microstructured surfaces to obtain high heat flux cooling with relatively low pressure drops. Our experiments demonstrate the substantial advantage of both force fed boiling and condensation when compared to conventional liquid cooling methods. Our results demonstrate dissipation of a heat flux of 450 W/cm with a heat transfer coefficient of 300.9 kW/m2K from silicon electronics using R-245fa as the working fluid. The corresponding pressure drop is 35 kPa. The governing heat transfer mechanism appears to be predominantly nucleate boiling with some contribution from convective boiling, depending on the heat flux level. For condensation, the force-fed method produces heat transfer coefficients up to 42.4 kW/mK using the working fluid, R245fa refrigerant. These two heat transfer processes have ...

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High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Journal of Electronic Packaging, 2017

This paper describes the use of the double cantilever beam (DCB) method for characterizing the ad... more This paper describes the use of the double cantilever beam (DCB) method for characterizing the adhesion strength of interfaces in advanced microelectronic packages at room and high temperatures. Those interfaces include silicon–epoxy underfill, solder resist–epoxy underfill and epoxy mold compounds (EMCs), and die passivation materials–epoxy underfill materials. A unique sample preparation technique was developed for DCB testing of each interface in order to avoid the testing challenges specific to that interface—for example, silicon cracking and voiding in silicon–underfill samples and cracking of solder resist films in solder resist–underfill samples. An asymmetric DCB configuration (i.e., different cantilever beam thickness on top compared to the bottom) was found to be more effective in maintaining the crack at the interface of interest and in reducing the occurrence of cohesive cracking when compared to symmetric DCB samples. Furthermore, in order to characterize the adhesion s...