Want to know all about additive processes and materials and specifically about ioTech’s innovative contactless technology for high resolution, high speed, conductive and die-electric materials deposition? Join Stéphane Etienne and Michael Zenou at the International Microelectronics Assembly and Packaging Society (IMAPS) symposium in Boston next week! Register here to the session on 2nd October at 10:30 ET: https://lnkd.in/eaHHrTJK #imaps #microdispensing #CLAD #additivemanufacturing
While facing the challenges of dispensing processes and the environmental impact of plating processes, envision a brighter future for the packaging industry with ioTech CLAD as the standard method of materials deposition. Join the club: When Light Vehicles Material. #imaps #microdispensing