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Tessolve to acquire Dream Chip Technologies GmbH🎉👇 Tessolve, a Hero Electronix venture and a leader in semiconductor engineering, has signed a definitive agreement to acquire Dream Chip Technologies, a semiconductor chip design firm headquartered in Germany, for around ₹400 Crore (EUR 42.5 million).   This acquisition, which is subject to regulatory approvals, will bolster Tessolve’s presence in the global semiconductor sector, particularly in the chip/ASIC design domain.   The acquisition of Dream Chip Technologies positions Tessolve among a group of global design firms equipped to deliver comprehensive solutions for complex, advanced semiconductor chips. By integrating Dream Chip’s capabilities, Tessolve aims to strengthen its expertise in System on Chip (SoC) design, expanding into critical sectors such as artificial intelligence (AI), automotive, data centres, and industrial applications. More: https://lnkd.in/dbCxu_Jj

Jolt Capital buys and invests in Dolphin Design’s carved-out mixed-signal IP activities 🎉👇 Grenoble (France), 5 November 2024 – Jolt Capital, a private equity firm specializing in European growth #deeptech, announces today having purchased the power management and signal processing IP activities of Dolphin Design (the « IP activities »), a leader in mixed-signal semiconductor IP through Dolphin Semiconductor, a newly created company, and to commit to already invest €26M in Dolphin Semiconductor. Laurent Monge, former President at Metrologic Group, is appointed CEO of Dolphin Semiconductor.   Dolphin Design has long been at the forefront of delivering cutting-edge mixed-signal IP, known for its unrivaled energy efficiency, robustness and performance. Dolphin Design’s business encompassed both fabless design and licensing of digital and analog IPs on one hand, custom #ASICs on the other. The IP activities acquired by Dolphin Semiconductor (power management and audio IP) represented about 60% of Dolphin Design’s revenue and patents portfolio. More: https://lnkd.in/eBbbH-pV #Acquisition #France #semiconductor #semiconductors

TSMC Faces Record Energy Prices 💡👇 [November 5, 2024] – Taiwan’s ambitious energy transition is creating significant challenges for its industries, particularly the semiconductor sector. Recent sharp increases in electricity prices and growing risks of power outages are impacting major companies, including Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest chipmaker.   TSMC’s Chief Financial Officer, Wendell Huang, recently revealed that the company anticipates paying the highest electricity prices in Taiwan next year, exceeding costs in all other regions where it operates. This marks a significant shift from a past competitive advantage of some of the world’s cheapest power. More: https://lnkd.in/etMgirDW

Sondrel announces CEO transition to lead next phase of growth🎉👇 Sondrel, a leading technology company providing ultra-complex custom chips for leading global technology brands, today announced that Oliver Jones will succeed John Chubb as Chief Executive Officer, effective November 1, 2024. This planned leadership transition comes as Sondrel prepares to enter its next phase of growth and advancement.   John Chubb, who assumed the role of CEO in July 2024, took the helm to accelerate and complete a major, company-wide transformation programme initiated and announced earlier this year. John has successfully led Sondrel through the crucial stages of comprehensive restructuring, including the formation of a new leadership team, delisting the company from AIM and the successful renegotiation of major supplier contracts, positioning the company for future success. Read more: https://lnkd.in/dnTRfY_A

Cyient Acquires Stake in Azimuth AI to Build Cutting-Edge #ASIC #Chips and Strengthen #Semiconductor Capabilities 🎉👇 Cyient, a global Intelligent Engineering services company, announced the acquisition of a 27.3% stake in Azimuth AI, a fabless custom ASIC company known for its expertise in intelligent energy and power solutions. This strategic investment marks a significant milestone in Cyient’s semiconductor journey and demonstrates the continued focus to drive accelerated growth in this industry. Read more: https://lnkd.in/dz2pnfYc Kevin Yang Joan Ceuterick Asif Mohammed Krishna Bodanapu Praveen Y.

In Q3 2024, X-FAB reported revenues of USD 206.4 million, marking a 12% decline year-on-year but a slight increase of 1% quarter-on-quarter. The company’s bookings amounted to USD 217.1 million, resulting in a book-to-bill ratio of 1.05, reflecting a robust demand despite market challenges. EBITDA was reported at USD 50.3 million, down 23% YoY but up 5% QoQ, with an EBITDA margin of 24.4%.   Looking ahead, X-FAB has adjusted its full-year revenue guidance to USD 822-832 million, citing current market conditions and an operational incident impacting production. The company’s long-term outlook remains optimistic, driven by strong end-market demand, particularly in automotive and medical sectors.   Strengths: Strong Automotive Demand: Robust growth in the automotive sector supports overall revenue stability. Positive Cash Flow: Q3 generated USD 78.8 million in net cash from operating activities, demonstrating strong operational efficiency.   Weaknesses: Declining Industrial and Medical Revenues: Significant YoY declines in these sectors reflect potential market saturation and reduced demand. Margin Compression: Increased costs led to a decreased gross profit margin, impacting overall profitability.   Highlights Revenue: USD 206.4 million Within guidance of USD 205-215 million Down 12% year-on-year (YoY) and up 1% quarter-on-quarter (QoQ) More: https://lnkd.in/dtp257B7

Global shipments of #silicon wafers are projected to decline 2% in 2024 to 12,174 million square inches (MSI) with a strong rebound of 10% delayed until 2025 to reach 13,328 MSI as wafer demand continues to recover from the downcycle, SEMI reported today in its annual silicon shipment forecast.   Strong silicon wafer shipment growth is expected to continue through 2027 to meet increasing demand related to AI and advanced processing, driving improved fab utilization rate for global semiconductor production capacity. Moreover, new applications in advanced packaging and high-bandwidth memory (HBM) production, which require additional wafers, are contributing to the rising need for silicon wafers. Such applications include temporary or permanent carrier wafers, interposers, device separation into chiplets, and memory/logic array separation. More: https://lnkd.in/dWrZVBcV

GlobalFoundries and NXP Semiconductors to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile. GlobalFoundries (Nasdaq: GFS) (GF) and NXP Semiconductors (NASDAQ: NXPI) today announced collaboration to drive next-generation solutions across a range of end markets including automotive, IoT and smart mobile devices. This collaboration leverages GF’s 22FDX® process technology platform and global manufacturing footprint to optimize the power, performance and time-to-market of NXP’s solutions. GF’s 22FDX chips will be manufactured in Dresden and Malta, New York, providing NXP geographically diverse supply for their customers. More: https://lnkd.in/dnEvYhB7

Arm Holdings Plc has terminated its architectural license agreement with Qualcomm Inc., ending Qualcomm’s ability to use Arm’s intellectual property for chip design. The termination, reported by Bloomberg, follows a 60-day notice from Arm. This action escalates an existing legal dispute between the two companies, set to begin in Delaware federal court this December. https://lnkd.in/diDhKz8d

MosChip® Technologies is now an AI/ML design partner under Renesas Electronics RZ partner ecosystems, delivering intelligent solutions based on Renesas RZ/V series of MPUs. 🎉👇   MosChip® Technologies is a #semiconductor design and product engineering services company with expertise in #SoC design, systems, software, mobility, connectivity, vision, AI/ML and #GenAI based solution design for diverse industrial domains. It is a trusted technology partner delivering high-performance next-gen solutions for seamless connectivity and intelligence across Products, IT, and Operations.   Designed by Renesas, a global leader in microcontrollers, SoCs, analog and power products, the RZ/V series MPUs deliver full-scale vision Artificial Intelligence (AI) solutions with excellent power efficiency. They enable fast real-time AI processing and robust AI inference performance for robotics, home appliances and industrial automation systems without cooling fans or heat sinks. The Renesas RZ Ready is an extensive network of trusted technology partners that deliver commercial-grade building blocks for Renesas RZ products. These partner solutions are designed to help accelerate the development of customer systems with ready-to-use solutions. Read the news here: https://lnkd.in/dpWVTkED Mustaqh Ali Shaik