Abstract: Three-dimensional (3D) field-effect transistors (FETs) such as FinFETs and nanowire FETs are device structures for extremely scaled FETs.
In this work, self-heating effects in scaled devices are experimentally evaluated and the co-optimization of thermal and electrical properties of devices in ...
Thermal-aware CMOS: Challenges for future technology and design ...
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In this paper, the critical importance of scaling theory to the success of CMOS technology will be reviewed and evaluated. The history of CMOS shows that ...
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A basic requirement for addressing on-chip thermal issues is to develop the ability to analyze and predict the thermal behavior of an inte- grated circuit.
Some of the most promising techniques are voltage scaling, thermal-aware archi- tectural planning, and thermal-aware physical design. Voltage scaling has ...
Oct 22, 2024 · We also discuss future extensions. Read more. Conference Paper. Thermal-aware CMOS: Challenges for future technology and design evolutions.
Thermal-aware CMOS: Challenges for future technology and design evolutions · K. UchidaTsunaki Takahashi. Engineering, Materials Science. 2016 46th European ...
The overall objective of this survey is to give microprocessor designers a broad perspective on various aspects of designing thermal-aware microprocessors and ...
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In this paper, we discuss the increasing impact of device scaling and increasing parameter variations on the leakage power dissipation in nanometer scale CMOS ...