Sep 23, 2019 · Abstract: Thermal characteristics have been considered as one of the most challenging problems in 3D integrated circuits (3D ICs).

Oct 7, 2019 · Inserting Thermal Through Silicon Vias (TTSVs) is one of the mainstream approaches of temperature-aware plan- ning for fixed-outline 3D ICs [10] ...

A computationally efficient thermal model that can be used to guide the thermal-aware floorplanning algorithm to reduce the peak temperature and a novel ...

Abstract— In this paper, we present a novel algorithm for 3D floorplanning with fixed outline constraints and a particular em- phasis on thermal awareness.

The proposed thermal analysis method can reduce the peak temperature by 6.7% on average with short runtime for 3D fixed-outline floorplanning.

In this paper, we present a novel algorithm for 3D floorplanning with fixed outline constraints and a particular emphasis on thermal awareness.

To address these challenges, this article proposes a novel end-to-end learning-based approach for thermal-aware fixed-outline 3-D IC floorplanning. In the tier ...

Oct 10, 2023 · High temperature and temperature nonuniformity pose significant challenges in 3-D integrated circuits (3-D ICs).

To address these challenges, this article proposes a novel end-to-end learning-based approach for thermal-aware fixed-outline 3-D IC floorplanning. In the tier ...

We have designed an integrated framework based on a set of algorithms to place functional units, air channels, through silicon vias and liquid channels. Our ...