We study how the manufacturing costs change when the number of layers, defect density, number of cores, and power consumption vary. For each design point, ...
Temperature- and Cost-Aware Design of 3D Multiprocessor Architectures. Ayse K. Coskun. Andrew B. Kahng. Tajana Simunic Rosing. University of California, San ...
This work investigates the tradeoffs between cost and temperature profile across various technology nodes of a multiprocessor SoC, and provides guidelines ...
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It explores the recent advanced cooling strategies, thermal modeling frameworks, design-time optimizations, and run-time thermal management schemes that are ...
In this paper, we propose a 3D many-core multiprocessor cost model, which includes wafer, bonding, package, and cooling cost analysis. Using the proposed cost ...
A Cooling Cost Model: In the proposed cost model, the peak steady state temperature of a target proces- sor determines the selection of a cooling solution, and.
Solving Memory Bandwith Issues with 3D MPSoCs. ▫ Benefits for memory configuration. • Reduce average length of on-chip global wires to other components.
Oct 22, 2024 · In this monograph, we provide an overall survey on the recent advances in temperature-aware 3D MPSoC considerations. We explore the recent ...
In this paper, we show that architecture-level thermal modeling exposes archi- tectural techniques that regulate temperature with lower perfor- mance cost than ...
In this paper, we propose a 3D many-core multiprocessor cost model, which includes wafer, bonding, package, and cooling cost analysis. Using the proposed cost ...