This paper investigates the challenges of a 3D-stacked system-on-chip testing, especially in terms of thermal problem. It is known that test power can be ...

This paper investigates the challenges of a 3D-stacked system-on-chip testing, especially in terms of thermal problem. It is known that test power can be ...

In this paper we have worked on test scheduling of 3D SoCs with thermal and time constraints. The circuits used have been built using benchmark SoC circuits.

RedSOCs-3D: Thermal-safe test scheduling for 3D-stacked SOC. Fawnizu Azmadi Hussin, Thomas Edison Yu, Tomokazu Yoneda, Hideo Fujiwara.

The method presented here involves a thermal aware test scheduling for a 3D Soc built up using floorplan of benchmark circuit d695 and few other examples. The ...

In this paper the test scheduling of 3D SoC has been considered taking the thermal aspect into account. The 3D SoC consists of a complete system stacked ...

The method presented here involves a thermal aware test scheduling for a 3D Soc built up using floorplan of benchmark circuit d695 and few other examples. The.

In this manuscript, a scheduling-based test time reduction scheme for post-bond testing of 3D SoCs is proposed, which aims to reduce the test time under the ...

Multicast-Based Testing and Thermal-Aware Test Scheduling for 3D ICs with a Stacked Network-on-Chip. ... RedSOCs-3D: Thermal-safe test scheduling for 3D-stacked ...

This paper presents a test partitioning method specifically designed for thermally constrained tests for the purpose of reducing test application time of 3D ...