Sep 8, 2016 · The monolithic 3D (M3D) IC technology enables ultra-high density vertical connections and provides a good path for technology node scaling.
The monolithic 3D (M3D) IC technology enables ultra-high density vertical connections and provides a good path for technology node scaling. Transistor-level (TR ...
For the first time, the detailed design as well as benefits and challenges of a silicon validated 14nm Finfet process design kit (PDK) based TR-L M3D IC ...
Bibliographic details on On the Design of Ultra-High Density 14nm Finfet Based Transistor-Level Monolithic 3D ICs.
The 3D cells are designed by splitting PMOS and NMOS transistors into two tiers within a standard cell, and the monolithic inter-layer vias (MIVs) are used for ...
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Shi et al., “On the Design of Ultra-High Density 14nm Finfet Based. Transistor-Level Monolithic 3D ICs,” in IEEE Computer Society Annual. Symposium on VLSI ...
On the Design of Ultra-High Density 14nm Finfet Based Transistor-Level Monolithic 3D ICs · Engineering, Materials Science. 2016 IEEE Computer Society Annual ...
Nov 21, 2024 · While a typical 14nm FinFET based 2D cell has at least 6 pin access points, a 3D cell may have only 3-4 due to its reduced footprint and the ...
A 14nm FinFET transistor-level 3D partitioning design to enable high-performance and low-cost monolithic 3D IC.
In this paper, we conduct a comprehensive design comparison of 2D ICs, monolithic 3D ICs and TSV-based 3D ICs using a silicon-validated 14nm FinFET foundry ...
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