In this paper, we comprehensively study the thermal feasibility of integrated systems consisting of the host CPU, die-stacking DRAMs, and various types of PIMs.
Oct 3, 2016 · In this paper, we comprehensively study the thermal feasibility of integrated systems consisting of the host CPU, die-stacking DRAMs, and ...
This paper comprehensively study the thermal feasibility of integrated systems consisting of the host CPU, die-stacking DRAMs, and various types of PIMs and ...
The focus of this paper is to investigate whether the thermal constraints of 3D integration make the concept of die-stacked. PIMs pointless for any further ...
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In this paper, we analyze the thermal impact of 3D IC technology on high-performance microprocessors by estimating the temperatures of a planar. IC based on the ...
In this paper, the focus is on stacking memory and the logic processor on the same substrate. In present technologies, logic processor and memory packages are ...
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Oct 22, 2024 · This work presents a theoretical model capable of fast calculating and optimizing the temperature of each die. The improved thermal network ...
In this study, we introduce a stagger-stacked DDR module that comprises one IPD chip (top die) along with four memory chips initially.
A complete system including packaged IC, socket and board is used to evaluate the thermal impact of a stacked memory die. Simulation and experimental ...
3D die-stacked DRAM thermal management via task allocation ...
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A major hurdle to adopt 3D stacked DRAM is a thermal problem particularly when the DRAM dies are stacked above the processor dies.