We review recent advances on hybrid III-V/Silicon devices using edge coupling. Design of external silicon cavities enables the realization of a broad range ...

We review recent advances on hybrid III-V/Silicon devices using edge coupling. Design of external silicon cavities enables the realization of a broad range of ...

We review recent advances on hybrid III-V/Silicon devices using edge coupling. Design of external silicon cavities enables the realization of a broad range ...

Hybrid III-V/Silicon integration: Enabling the next generation of advanced photonic transmitters. de Valicourt, G., Chang, C., Eggleston, M. S., Melikyan, ...

Hybrid III-V/Silicon integration: Enabling the next generation of advanced photonic transmitters. de Valicourt, G., Chang, C. M., Eggleston, M. S., Melikyan ...

This paper summarizes recent advances of integrated hybrid InP/SOI lasers and transmitters based on wafer bonding.

Abstract—This paper summarizes recent advances of integrated hybrid InP/SOI lasers and transmitters based on wafer bonding. At first the integration process of ...

The integration of hybrid lasers on silicon also enables the fabrication of more complete photonic circuits such as transmitters and receivers [5]. Hybrid ...

Jan 25, 2024 · We chart the generational trends in silicon photonics technology, drawing parallels from the generational definitions of CMOS technology.

This technology for the hybrid integration of III-V/silicon photonics devices can enable the creation of more complex and powerful chip-scale photonic systems.