Abstract. 3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into.
This paper examines the 3-D design approach and provides an analysis concluding that the commodity die system need not be independently trustworthy for the ...
We discuss the security advantages of using 3-D integrated hardware in sensitive applications, where security is of the utmost importance, and we outline ...
effect on the performance of the cache subsystem. Performance Evaluation: We evaluated the perfor- mance impact of locking specific cache lines with our 3-D.
In a developed example we show how this approach can increase system trustworthiness, through mitigating the cache-based side channel problem by routing signals ...
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A new architecture using a separate control plane, stacked using 3D integration, that allows for the function and economics of specialized security ...
Oct 12, 2013 · These 3D advantages are leveraged to offer enhanced security in commodity hardware. The basic approach is to slightly modify the design of an ...
Jun 6, 2019 · Toward enforcing security at runtime, we envision secure 2.5D system-level integration of untrusted chips and “all around” shielding for 3D ICs.
Three-dimensional heterogeneous integration offers compelling opportunities to enhance the security and trust in the current semiconductor chain.
Presentation on theme: "Hardware Trust Implications of 3-D Integration Ted Huffmire (NPS), Timothy Levin (NPS), Michael Bilzor (NPS), Cynthia E. Irvine (NPS), ...