Aug 30, 2021 · Our thermal-aware evaluation results show that the best configuration of the M3D microprocessors reduces average energy consumption by 27.6% ...
In this paper, for the first time, we explore the thermal feasibility (whether it is possible to achieve high energy efficiency and performance without ...
Sep 8, 2021 · For the thermal feasibility study, we construct an integrated framework to investigate the thermal behaviors and thermal feasibility of ...
2019. Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors. JH Lee, YS Lee, JH Choi, H Amrouch, J Kong, YH Gong, SW Chung. IEEE Access 9 ...
In this work, we propose the design of a thermally efficient dataflow-aware monolithic 3D (M3D) NoC architecture referred to as TEFLON to accelerate CNN ...
Characterizing the Thermal Feasibility of Monolithic 3D Microprocessorsopen aceess. Lee, Ji Heon; Lee, Young Seo; Choi, Jeong Hwan ...
Co-authors ; Characterizing the thermal feasibility of monolithic 3D microprocessors. JH Lee, YS Lee, JH Choi, H Amrouch, J Kong, YH Gong, SW Chung. IEEE Access ...
Oct 30, 2023 · It was demonstrated that, for near-memory computing, M3D integrated resistive memory is thermally more feasible than embedded dynamic memory and ...
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... Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors", IEEE Access, vol.9, pp. 120715-120729, August 2021. ○ [IEEE ACCESS – SCIE IF ...
Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors.IEEE Access 9: 120715-120729 (2021). paper. [j8]. Q2. Young Seo Lee, Eui-Young Chung ...