SIGCSE Technical Symposium 2023 Report
Authors: 
Maureen Doyle, 
Ben Stephenson, 
Brian Dorn, Leen-Kiat Soh, 
Lina Battestilli, 
Kristin Stephens-Martinez, Delaram YazdansepasAuthors Info & Claims
Maureen Doyle, Ben Stephenson, Brian Dorn, Leen-Kiat Soh, Lina Battestilli, Kristin Stephens-Martinez, Delaram YazdansepasAuthors Info & ClaimsPages 3 - 6
Abstract
The 2023 SIGCSE Technical Symposium has come to a close. Thank you, all 1,554 of you, that joined us in Toronto and online for the first-ever SIGCSE Technical Symposium held outside the United States. We enjoyed welcoming 1,354 of you to Canada in person, as well as an additional 200 of you who registered for online attendance. While we didn't set a new attendance record, we did exceed last year's attendance, and look forward to seeing our attendance continue to grow back toward its pre-pandemic levels in 2024.
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Published In
April 2023
23 pages
Copyright © 2023 Copyright is held by the owner/author(s).
Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.
Publisher
Association for Computing Machinery
New York, NY, United States
Publication History
Published: 05 July 2023
Published in SIGCSE Volume 55, Issue 2
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