research-article

Thermal and Performance Efficient On-Chip Surface-Wave Communication for Many-Core Systems in Dark Silicon Era

Authors:

Kin-Fai TongAuthors Info & Claims

ACM Journal on Emerging Technologies in Computing Systems (JETC), Volume 18, Issue 3

Article No.: 49, Pages 1 - 18

https://doi.org/10.1145/3501771

Published: 22 March 2022 Publication History

Abstract

Due to the exceedingly high integration density of VLSI circuits and the resulting high power density, thermal integrity became a major challenge. One way to tackle this problem is Dark silicon. Dark silicon is the amount of circuitry in a chip that is forced to switch off to insure thermal integrity of the system and prevent permanent thermal-related faults. In many-core systems, the presence of Dark Silicon adds new design constraints, in general, and on the communication fabric of such systems, in particular. This is due to the fact that system-level thermal-management systems tend to increase the distance between high activity cores to insure better thermal balancing and integrity. Consequently, a designing dilemma is created where a compromise has to be made between interconnect performance and power consumption. This study proposes a hybrid wire and surface-wave interconnect (SWI) based Network-on-Chip (NoC) to address the dark silicon challenge. Through efficient utilization of one-hop cross the chip communication SWI links, the proposed architecture is able to offer an efficient and scalable communication platform in terms of performance, power, and thermal impact. As a result, evaluations of the proposed architecture compared to baseline architecture under dark silicon scenarios show reduction in maximum temperature by 15∘C, average delay up to 73.1%, and energy-saving up to ∼3X. This study explores the promising potential of the proposed architecture in extending the utilization wall for current and future many-core systems in dark silicon era.

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Index Terms

Thermal and Performance Efficient On-Chip Surface-Wave Communication for Many-Core Systems in Dark Silicon Era
1. Hardware

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Published In

cover image ACM Journal on Emerging Technologies in Computing Systems

ACM Journal on Emerging Technologies in Computing Systems Volume 18, Issue 3

July 2022

428 pages

ISSN:1550-4832

EISSN:1550-4840

DOI:10.1145/3508463

Editor:
Ramesh Karri
Polytechnic Institute of New York University, USA

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New York, NY, United States

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Publication History

Published: 22 March 2022

Accepted: 01 November 2021

Revised: 01 September 2021

Received: 01 March 2021

Published in JETC Volume 18, Issue 3

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https://dl.acm.org/doi/10.1007/s10617-024-09292-0
Weber IZanini VMoraes F(2024)Enhancing Manycore Lifetime Through Reinforcement Learning Task Mapping and Migration2024 37th SBC/SBMicro/IEEE Symposium on Integrated Circuits and Systems Design (SBCCI)10.1109/SBCCI62366.2024.10703980(1-5)Online publication date: 2-Sep-2024
https://doi.org/10.1109/SBCCI62366.2024.10703980
Liu QZhao FWu FTong KWong K(2024)Simulation Verification on OTA Characteristics of Surface Wave Propagation System2024 IEEE 10th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE)10.1109/MAPE62875.2024.10813963(1-3)Online publication date: 27-Nov-2024
https://doi.org/10.1109/MAPE62875.2024.10813963
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Tong KWong K(2023)Surface Wave Technique Enabled RIS Applications2023 IEEE 11th Asia-Pacific Conference on Antennas and Propagation (APCAP)10.1109/APCAP59480.2023.10470036(1-2)Online publication date: 22-Nov-2023
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