Paper
28 March 2014 Yield-aware decomposition for LELE double patterning
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Abstract
In this paper, we propose a fast layout decomposition algorithm in litho-etch-litho-etch (LELE) type double patterning considering the yield. Our proposed algorithm extracts stitch candidates properly from complex layouts including various patterns, line widths and pitches. The planarity of the conflict graph and independence of stitch-candidates are utilized to obtain a layout decomposition with minimum cost efficiently for higher yield. The validity of our proposed algorithm is confirmed by using benchmark layout patterns used in literatures as well as layout patterns generated to fit the target manufacturing technologies as much as possible. In our experiments, our proposed algorithm is 7.7 times faster than an existing method on average.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yukihide Kohira, Yoko Yokoyama, Chikaaki Kodama, Atsushi Takahashi, Shigeki Nojima, and Satoshi Tanaka "Yield-aware decomposition for LELE double patterning", Proc. SPIE 9053, Design-Process-Technology Co-optimization for Manufacturability VIII, 90530T (28 March 2014); https://doi.org/10.1117/12.2046180
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Cited by 5 scholarly publications.
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KEYWORDS
Legal

Double patterning technology

Photomasks

Semiconducting wafers

Lithography

Manufacturing

Detection and tracking algorithms

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