short-paper

Characterization of SWCNT Bundle Based VLSI Interconnect with Self-heating Induced Scatterings

Authors:

Ashok SrivastavaAuthors Info & Claims

GLSVLSI '15: Proceedings of the 25th edition on Great Lakes Symposium on VLSI

Pages 265 - 270

https://doi.org/10.1145/2742060.2742074

Published: 20 May 2015 Publication History

Abstract

Performance of single walled carbon nanotube (SWCNT) bundle- based VLSI interconnects has been studied under the strong influence of scatterings induced by self-heating. Landauer Büttiker formalism along with Fourier heat transfer equation have been used to compute interconnect scattering parameters at various cross sectional areas of the interconnection. Cross sectional temperature calculation was performed using finite difference method considering temperature dependent thermal conductivity for primitive defect-less SWCNT bundles. Using the relaxation time approximation, we have studied scattering dynamics in calculating equivalent resistance. Electronic and thermal transport equations have been coupled and solved iteratively to get accurate estimation of temperatures and resistances. Study of scattering parameters shows low backscattering however significant transmission loss. Below 100GHz, for a 1µm long interconnect with 10 nm by10 nm cross sectional area shows S₂₁ as high as 80dB. In terahertz regime transmission parameter S₂₁ is in the range of few hundreds dB.

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Cited By

Sathyakam PBanerjee AMallick P(2019)On the Applicability of Triangular Carbon Nanotube Bundles as VLSI interconnects2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)10.1109/EPTC47984.2019.9026693(578-581)Online publication date: Dec-2019
https://doi.org/10.1109/EPTC47984.2019.9026693
Uma Sathyakam PMallick P(2017)Carbon Nanotube Interconnects with Air-Gaps: Effect on Thermal Stability, Delay and AreaJournal of Nano Research10.4028/www.scientific.net/JNanoR.48.2948(29-37)Online publication date: Jul-2017
https://doi.org/10.4028/www.scientific.net/JNanoR.48.29
Mohsin KSrivastava A(2017)Modeling of Joule Heating Induced Effects in Multiwall Carbon Nanotube InterconnectsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2017.273788425:11(3089-3098)Online publication date: Nov-2017
https://doi.org/10.1109/TVLSI.2017.2737884

Index Terms

Characterization of SWCNT Bundle Based VLSI Interconnect with Self-heating Induced Scatterings
1. Hardware
  1. Very large scale integration design

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cover image ACM Conferences

GLSVLSI '15: Proceedings of the 25th edition on Great Lakes Symposium on VLSI

May 2015

418 pages

ISBN:9781450334747

DOI:10.1145/2742060

General Chairs:
Alex K. Jones
University of Pittsburgh, USA
,
Hai (Helen) Li
University of Pittsburgh, USA
,
Program Chairs:
Ayse K. Coskun
Boston University, USA
,
Martin Margala
University of Massachusetts, Lowell, USA

Copyright © 2015 ACM.

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Published: 20 May 2015

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U.S. Air Force Research Laboratory

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GLSVLSI '15

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SIGDA

GLSVLSI '15: Great Lakes Symposium on VLSI 2015

May 20 - 22, 2015

Pennsylvania, Pittsburgh, USA

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GLSVLSI '15 Paper Acceptance Rate 41 of 148 submissions, 28%;

Overall Acceptance Rate 312 of 1,156 submissions, 27%

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Cited By

Sathyakam PBanerjee AMallick P(2019)On the Applicability of Triangular Carbon Nanotube Bundles as VLSI interconnects2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)10.1109/EPTC47984.2019.9026693(578-581)Online publication date: Dec-2019
https://doi.org/10.1109/EPTC47984.2019.9026693
Uma Sathyakam PMallick P(2017)Carbon Nanotube Interconnects with Air-Gaps: Effect on Thermal Stability, Delay and AreaJournal of Nano Research10.4028/www.scientific.net/JNanoR.48.2948(29-37)Online publication date: Jul-2017
https://doi.org/10.4028/www.scientific.net/JNanoR.48.29
Mohsin KSrivastava A(2017)Modeling of Joule Heating Induced Effects in Multiwall Carbon Nanotube InterconnectsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2017.273788425:11(3089-3098)Online publication date: Nov-2017
https://doi.org/10.1109/TVLSI.2017.2737884

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