ZEISS Microscopy

🌟 We are honored to share that our innovative ZEISS navx interface has received the prestigious 2024 Red Dot “Best of the Best” Award in the Interface Design & User Experience category. 🏆 The award represents global design excellence, selected from over 20k entries, from 60+ countries, across 30+ categories and judged on a number of factors, including: functionality, quality, ergonomics, innovation, durability, and ecological compatibility. Created using a bespoke iterative human-centered design methodology and developed with our design partners Clarity (now Box Clever) and Airlift, ZEISS navx makes the power of advanced 3D X-ray microscope technology accessible to all, enabling users of any experience level to achieve high-precision results. This prestigious recognition reflects our commitment to innovation, global impact, and user-centric design. A huge thank you to our incredible team and supporters! 🎉 For further information on the award, visit: https://lnkd.in/dV3XTVQC #RedDotAward #InnovationInDesign #XrayMicroscopy

Discover how advanced 3D/4D imaging and AI-powered analyses are transforming drug discovery with complex in vitro models (CIVM). From automating image analysis to identifying drug response patterns in large datasets, learn cutting-edge tools and techniques that address key challenges in preclinical research. Register now to explore how these innovations can enhance your research: https://lnkd.in/edZdqR4w  Sample: courtesy of Dr. Martin Engel from Inventia Life Science.

Boo-tiful Biology! 👻🐔🔬 This Halloween, even the tiniest of creatures are getting into the spirit! Check out this microscopic image where a 12 μm cryosection from the head of an early chicken embryo forms a ghostly face. Who knew science could be so hauntingly beautiful? The image has been acquired with a ZEISS LSM 780 laser scanning microscope with ZEISS Axio Imager Z.2 and kindly provided by Ádám Soós of Semmelweis Egyetem, Budapest, Hungary. #halloween #ghost #confocalimaging

📣 All ISTFA attendees - Stop by booth #601 to learn about the latest advances in microscopy solutions for failure analysis and process development. We're excited to reveal our latest innovation, ZEISS Crossbeam 550 Samplefab FIB-SEM, designed for easy, automated TEM sample preparation. 🚀 And come learn how our new ZEISS VersaXRM 730 3D X-ray microscope helps you gain perfect package insights – every user, every sample, every time. 🌟 Let ZEISS help you tackle failure analysis challenges with unparalleled precision and speed. We're waiting to you meet you at our booth!

📣 We’re excited to announce our latest innovation in microscopy technology…introducing the new ZEISS Crossbeam 550 Samplefab FIB-SEM! Built for efficiency and throughput in the semiconductor lab, Crossbeam 550 Samplefab is optimized for fully-automated TEM sample preparation. Crossbeam 550 Samplefab promises an industry-leading automation yield of >90% for processing lamellae from bulk to TEM grid without operator intervention. Attending ISFTA 2024? Come see us at booth #601 to learn more about the new Crossbeam 550 Samplefab and other microscopy solutions from ZEISS for solving failure analysis challenges. In the meantime, check out the video below for a preview or click here to get more information https://lnkd.in/dYsC9Wk5

We are thrilled to announce that our company has been honored with the 2024 Microscopy Today Innovation Award for ZEISS Volutome! 🏆🎉 We are proud to provide the research community with an in-chamber ultramicrotome for serial block-face imaging with FE-SEMs, enabling 3D volumetric imaging of the ultrastructure of biological samples. With applications in neuroscience, cell biology, cancer research, and plant science, ZEISS Volutome represents a significant advancement in the field of microscopy, offering increased stability, sensitivity, and speed for unattended imaging. Thank you for your ongoing support and partnership in advancing scientific research and discovery! Learn more about ZEISS Volutome: https://lnkd.in/ewg-bGAa

Heading to ISFTA 2024 next week? So are we!🔬 🗓️ Date: October 28 – November 1, 2024 📍 Location: Hilton San Diego Bayfront, San Diego, Calif. In step with the theme at #ISTFA2024, our experts are giving paper presentations on AI-enabled methods including: - Using AI-based image segmentation for FIB-SEM tomography data - Correlative microscopic workflow powered by AI to accelerate failure analysis of next-gen semiconductor packages - Integrating an AI-powered multimodal microscopy workflow to identify laser-induced defects Join us for all six of our paper presentations. See the full schedule here: https://lnkd.in/dtSJdtgs We look forward to sharing our insights with you!

Are you attending the 50th annual ISTFA Conference? If so, join us for our four tutorial sessions at the conference! 🔬 📅 Date: October 28 – November 1, 2024 📍 Location: Hilton San Diego Bayfront, San Diego, Calif. Our team of experts will share methods for solving failure analysis challenges including AI-driven advancements in image processing, analysis and 3D modeling, defect localization, scanning electron microscopy, and 3D X-ray microscopy. View our full schedule of sessions here: https://lnkd.in/dkXj6Jhc We look forward to seeing you there!

Check out our latest article on advanced package failure analysis (FA) with artificial intelligence (AI)-powered 3D X-ray microscopy (XRM) in the September/October issue of Chip Scale Review Magazine. 3D X-ray microscopy features high-resolution, non-destructive imaging capabilities and an ability to clearly image different interconnects in complex multi-chip packages. And with ZEISS AI-powered XRM, there are no trade-offs that must be balanced between field-of-view and resolution. Read the article to learn how AI is being applied to the reconstruction step to enhance imaging quality and speed data acquisition by 4x: https://lnkd.in/gXFwXMJu

Meet ZEISS at ISTFA 2024 in San Diego (USA). With over 10 talks and panel discussions, ZEISS experts will present solutions in: - artificial intelligence-powered fault isolation - failure analysis - yield enhancement Stop by booth 601 to see a preview of our new FIB-SEM solutions. And sign up for an in-booth demo of our new VersaXRM 730 3D X-ray microscope. Take a look at our schedule: https://lnkd.in/eUQN66aV