"Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages."

Liang Zhang et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.05.008

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type: Journal Article

metadata version: 2022-06-10

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Liang Zhang, Songbai Xue, Li-li Gao, Zhong Sheng, Sheng-lin Yu, Yan Chen, Wei Dai, Feng Ji, Zeng Guang:
Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages. Microelectron. Reliab. 50(12): 2071-2077 (2010)

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