"Chemical flip-chip bonding method for fabricating 10-µm-pad-pitch ..."

Yasuhiro Yamaji et al. (2008)

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DOI: 10.1587/ELEX.5.732

access: open

type: Journal Article

metadata version: 2021-02-12

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Yasuhiro Yamaji, Tokihiko Yokoshima, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi:
Chemical flip-chip bonding method for fabricating 10-µm-pad-pitch interconnect. IEICE Electron. Express 5(18): 732-737 (2008)

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