"Test-Cost Reduction for 2.5D ICs Using Microspring Technology for Die ..."

Zhanwei Zhong et al. (2019)

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DOI: 10.1109/VTS.2019.8758669

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-03

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Zhanwei Zhong, Tom B. Wrigglesworth, Eugene M. Chow, Krishnendu Chakrabarty:
Test-Cost Reduction for 2.5D ICs Using Microspring Technology for Die Attachment and Rework. VTS 2019: 1-6

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