"Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated ..."

Wei Lu et al. (2024)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631526

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type: Conference or Workshop Paper

metadata version: 2024-10-17

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Wei Lu, Jie Zhang, Yi-Hui Wei, Hsu-Ming Hsiao, Sih-Han Li, Chao-Kai Hsu, Chih-Cheng Hsiao, Feng-Hsiang Lo, Shyh-Shyuan Sheu, Chin-Hung Wang, Wei-Chung Lo, Shih-Chieh Chang, Hung-Ming Chen, Kuan-Neng Chen, Po-Tsang Huang:
Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated LDOs for Low-Cost Programmable 2.5D/3.5D Packaging Technology. VLSI Technology and Circuits 2024: 1-2

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