"3DIC Design: Challenges and Opportunities in System-of-Chips Integration."

Ming Zhang (2022)

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DOI: 10.1145/3505170.3511473

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type: Conference or Workshop Paper

metadata version: 2022-04-14

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Ming Zhang:
3DIC Design: Challenges and Opportunities in System-of-Chips Integration. ISPD 2022: 81

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