"Multi-Stripline Redistribution Layer Interposer Channel Design for High ..."

Jiwon Yoon et al. (2023)

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DOI: 10.1109/ISOCC59558.2023.10396127

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type: Conference or Workshop Paper

metadata version: 2024-02-22

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Jiwon Yoon, Hyunwoo Kim, Boogyo Sim, Hyunwook Park, Yi-Gyeong Kim, Sujin Park, Youngsu Kwon, Joungho Kim:
Multi-Stripline Redistribution Layer Interposer Channel Design for High Bandwidth Memory Module Considering Via Interconnect. ISOCC 2023: 247-248

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