"Enhanced reliability of hexagonal boron nitride dielectric stacks due to ..."

Xianhu Liang et al. (2018)

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DOI: 10.1109/IRPS.2018.8353666

access: closed

type: Conference or Workshop Paper

metadata version: 2019-05-29

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Xianhu Liang, Bin Yuan, Yuanyuan Shi, Fei Hui, Xu Jing, Mario Lanza, Felix Palumbo:
Enhanced reliability of hexagonal boron nitride dielectric stacks due to high thermal conductivity. IRPS 2018: 6-1

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