"Towards a general purpose mixed-signal instrumentation layer in the die ..."

Shudong Lin, Gordon W. Roberts (2014)

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DOI: 10.1109/ETS.2014.6847832

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-22

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Shudong Lin, Gordon W. Roberts:
Towards a general purpose mixed-signal instrumentation layer in the die stack of a 3D-SIC. ETS 2014: 1-2

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