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ORCIDStéphane Moreau
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2020 – today
- 2024
[c14]Yong Hyeon Yi, Chris H. Kim, Armen Kteyan, Alexander Volkov, Stéphane Moreau, Valeriy Sukharev:
Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis. IRPS 2024: 1-6- [c13]Jun-Ho Choy
, Stéphane Moreau, Catherine Brunet-Manquat, Valeriy Sukharev, Armen Kteyan:
Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects. ISPD 2024: 85-90 - 2023
- [c12]Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne:
Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits. IRPS 2023: 1-7 - [c11]Armen Kteyan, Valeriy Sukharev, Alexander Volkov, Jun-Ho Choy, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Stéphane Moreau:
Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution. ISPD 2023: 124-132 - 2022
- [c10]Bassel Ayoub, Stéphane Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, Hélène Frémont:
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects. IRPS 2022: 4 - 2021
- [c9]Christophe Dubarry, Lucile Arnaud, Maria-Luisa Calvo-Muñoz, Gaëlle Mauguen, Stéphane Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier:
3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. 3DIC 2021: 1-4 - [c8]Antonio Alguacil, Wagner Gonçalves Pinto, Michael Bauerheim, Marc C. Jacob, Stéphane Moreau:
Effects of Boundary Conditions in Fully Convolutional Networks for Learning Spatio-Temporal Dynamics. ECML/PKDD (5) 2021: 102-117 - [i1]Antonio Alguacil, Wagner Gonçalves Pinto, Michael Bauerheim, Marc C. Jacob, Stéphane Moreau:
Effects of boundary conditions in fully convolutional networks for learning spatio-temporal dynamics. CoRR abs/2106.11160 (2021)
2010 – 2019
- 2018
- [j7]J. de Laborderie, Florent Duchaine, Laurent Gicquel, Olivier Vermorel, Gaofeng Wang, Stéphane Moreau:
Numerical analysis of a high-order unstructured overset grid method for compressible LES of turbomachinery. J. Comput. Phys. 363: 371-398 (2018) - [c7]Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux:
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. IRPS 2018: 4 - 2016
- [c6]Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy:
ITAC: A complete 3D integration test platform. 3DIC 2016: 1-4 - 2015
- [j6]Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, Karim Inal, François Bay, Marc Zelsmann, Emmanuel Picard, Mathieu Salaün:
Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence. Microelectron. Reliab. 55(8): 1205-1213 (2015) - [j5]Pablo Salas, Luc Giraud, Yousef Saad, Stéphane Moreau:
Spectral recycling strategies for the solution of nonlinear eigenproblems in thermoacoustics. Numer. Linear Algebra Appl. 22(6): 1039-1058 (2015) - 2014
- [j4]Gaofeng Wang, Florent Duchaine, Dimitrios Papadogiannis, Ignacio Duran, Stéphane Moreau, Laurent Y. M. Gicquel:
An overset grid method for large eddy simulation of turbomachinery stages. J. Comput. Phys. 274: 333-355 (2014) - [c5]Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix:
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding. 3DIC 2014: 1-8 - 2013
- [j3]Thomas Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, Emmanuel Chery, F. Lorut, Lorena Anghel, Gilles Poupon:
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. Microelectron. Reliab. 53(1): 17-29 (2013) - [c4]Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry:
Chip to wafer copper direct bonding electrical characterization and thermal cycling. 3DIC 2013: 1-7 - [c3]Sofiane Soulimane, Arnaud Pouydebasque, Sébastien Bolis, Fabrice Jacquet, Claudine Bridoux, Florian Dupont, Christophe Poulain, Stéphane Moreau, Stephane Fanget:
A new experimental methodology using point deflection to quantify residual stress of thin polymer membrane materials in MEMS devices. NEMS 2013: 486-489 - 2011
- [c2]Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix:
200°C direct bonding copper interconnects : Electrical results and reliability. 3DIC 2011: 1-4
2000 – 2009
- 2005
- [c1]Laurent Toubiana, Stéphane Moreau, Gaétan Bonnard:
MetaSurv: Web-Platform Generator for the Monitoring of Health Indicators and Interactive Geographical Information System. MIE 2005: 989-993 - 2004
- [j2]Stéphane Moreau, Thierry Lequeu, Robert Jérisian:
Comparative study of thermal cycling and thermal shocks tests on electronic components reliability. Microelectron. Reliab. 44(9-11): 1343-1347 (2004) - 2002
- [j1]Stéphane Moreau, Stéphane Forster, Thierry Lequeu, Robert Jérisian:
Influence of the turn-on mechanism on TRIACs' reliability: di/dt thermal fatigue study in Q1 compared to Q2. Microelectron. Reliab. 42(9-11): 1663-1666 (2002)
Coauthor Index
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last updated on 2024-10-07 21:16 CEST by the dblp team
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