"6W/25mm2 inductive power transfer for non-contact wafer-level ..."

Andrzej Radecki et al. (2011)

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DOI: 10.1109/ISSCC.2011.5746297

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Andrzej Radecki, Hayun Chung, Yoichi Yoshida, Noriyuki Miura, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda:
6W/25mm² inductive power transfer for non-contact wafer-level testing. ISSCC 2011: 230-232

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