"Reliability investigation and mechanism analysis for a novel bonding ..."

Yu-Tao Yang, Yu-Chen Hu, Kuan-Neng Chen (2016)

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DOI: 10.1109/3DIC.2016.7970010

access: closed

type: Conference or Workshop Paper

metadata version: 2017-07-13

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Yu-Tao Yang, Yu-Chen Hu, Kuan-Neng Chen:
Reliability investigation and mechanism analysis for a novel bonding method of flexible substrate in 3D integration. 3DIC 2016: 1-4

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