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ORCIDLingjun Zhu
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2020 – today
- 2024
[j11]Jinwoo Kim
, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim:
A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping. IEEE Trans. Very Large Scale Integr. Syst. 32(3): 401-412 (2024)- [c20]Nesara Eranna Bethur, Pruek Vanna-Iampikul, Odysseas Zografos, Lingjun Zhu, Giuliano Sisto, Dragomir Milojevic, Alberto García Ortiz, Geert Hellings, Julien Ryckaert, Francky Catthoor, Sung Kyu Lim:
GNN-assisted Back-side Clock Routing Methodology for Advance Technologies. DAC 2024: 287:1-287:6 - [c19]Weidong Zhang, Erci Xu, Qiuping Wang, Xiaolu Zhang, Yuesheng Gu, Zhenwei Lu, Tao Ouyang, Guanqun Dai, Wenwen Peng, Zhe Xu, Shuo Zhang, Dong Wu, Yilei Peng, Tianyun Wang, Haoran Zhang, Jiasheng Wang, Wenyuan Yan, Yuanyuan Dong, Wenhui Yao, Zhongjie Wu, Lingjun Zhu, Chao Shi, Yinhu Wang, Rong Liu, Junping Wu, Jiaji Zhu, Jiesheng Wu:
What's the Story in EBS Glory: Evolutions and Lessons in Building Cloud Block Store. FAST 2024: 277-291 - [c18]Lingjun Zhu, Jiawei Hu, Gauthaman Murali, Sung Kyu Lim:
Hetero-3D: Maximizing Performance and Power Delivery Benefits of Heterogeneous 3D ICs. ISLPED 2024: 1-6 - [i3]Xuzheng Chen, Jie Zhang, Ting Fu, Yifan Shen, Shu Ma, Kun Qian, Lingjun Zhu, Chao Shi, Yin Zhang, Ming Liu, Zeke Wang:
Demystifying Datapath Accelerator Enhanced Off-path SmartNIC. CoRR abs/2402.03041 (2024) - 2023
- [j10]Menghan Hu, Qingyi Zhu, Lingjun Zhu:
What are the actual needs of visually impaired people? Displays 78: 102411 (2023) - [j9]Kaihui Gao, Chen Sun, Shuai Wang, Dan Li, Yu Zhou, Hongqiang Harry Liu, Lingjun Zhu, Ming Zhang, Xiang Deng, Cheng Zhou, Lu Lu:
Buffer-Based High-Coverage and Low-Overhead Request Event Monitoring in the Cloud. IEEE/ACM Trans. Netw. 31(4): 1732-1747 (2023) - [j8]Gauthaman Murali, Aditya Iyer, Lingjun Zhu, Jianming Tong, Francisco Muñoz-Martínez, Srivatsa Rangachar Srinivasa, Tanay Karnik, Tushar Krishna, Sung Kyu Lim:
On Continuing DNN Accelerator Architecture Scaling Using Tightly Coupled Compute-on-Memory 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 31(10): 1603-1613 (2023) - [c17]Pruek Vanna-Iampikul, Lingjun Zhu, Serhat Erdogan, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Sung Kyu Lim:
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. DAC 2023: 1-6 - [c16]Lingjun Zhu, Sung Kyu Lim:
INVITED: Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps. DAC 2023: 1-4 - [c15]Jie Zhang, Hongjing Huang, Lingjun Zhu, Shu Ma, Dazhong Rong, Yijun Hou, Mo Sun, Chaojie Gu, Peng Cheng, Chao Shi, Zeke Wang:
SmartDS: Middle-Tier-centric SmartNIC Enabling Application-aware Message Split for Disaggregated Block Storage. ISCA 2023: 42:1-42:13 - [c14]Sandra Maria Shaji, Lingjun Zhu, Jun-Sik Yoon, Sung Kyu Lim:
A Comparative Study on Front-Side, Buried and Back-Side Power Rail Topologies in 3nm Technology Node. ISLPED 2023: 1-6 - [c13]Lingjun Zhu, Yifan Shen, Erci Xu, Bo Shi, Ting Fu, Shu Ma, Shuguang Chen, Zhongyu Wang, Haonan Wu, Xingyu Liao, Zhendan Yang, Zhongqing Chen, Wei Lin, Yijun Hou, Rong Liu, Chao Shi, Jiaji Zhu, Jiesheng Wu:
Deploying User-space TCP at Cloud Scale with LUNA. USENIX ATC 2023: 673-687 - 2022
- [j7]Lingjun Zhu, Arjun Chaudhuri, Sanmitra Banerjee, Gauthaman Murali, Pruek Vanna-Iampikul, Krishnendu Chakrabarty, Sung Kyu Lim:
Design Automation and Test Solutions for Monolithic 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 18(1): 21:1-21:49 (2022) - [j6]Yi-Chen Lu, Sai Pentapati, Lingjun Zhu, Gauthaman Murali, Kambiz Samadi, Sung Kyu Lim:
A Machine Learning-Powered Tier Partitioning Methodology for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(11): 4575-4586 (2022) - [c12]Lingjun Zhu, Nesara Eranna Bethur, Yi-Chen Lu, Youngsang Cho, Yunhyeok Im, Sung Kyu Lim:
3D IC Tier Partitioning of Memory Macros: PPA vs. Thermal Tradeoffs. ISLPED 2022: 19:1-19:6 - [c11]Kaihui Gao, Chen Sun, Shuai Wang, Dan Li, Yu Zhou, Hongqiang Harry Liu, Lingjun Zhu, Ming Zhang:
Buffer-based End-to-end Request Event Monitoring in the Cloud. NSDI 2022: 829-843 - [c10]Rui Miao, Lingjun Zhu, Shu Ma, Kun Qian, Shujun Zhuang, Bo Li, Shuguang Cheng, Jiaqi Gao, Yan Zhuang, Pengcheng Zhang, Rong Liu, Chao Shi, Binzhang Fu, Jiaji Zhu, Jiesheng Wu, Dennis Cai, Hongqiang Harry Liu:
From luna to solar: the evolutions of the compute-to-storage networks in Alibaba cloud. SIGCOMM 2022: 753-766 - 2021
- [j5]Lingjun Zhu, Xiaodong Wang, Tania Akter Asa, Md. Ali Hossain:
Identification of key genes, pathways, and associated comorbidities in chikungunya infection: insights from system biology analysis. Netw. Model. Anal. Health Informatics Bioinform. 10(1): 57 (2021) - [j4]Lingjun Zhu, Lennart Bamberg, Sai Surya Kiran Pentapati, Kyungwook Chang, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Brian Cline, Saurabh Sinha, Xiaoqing Xu, Alberto García-Ortiz, Sung Kyu Lim:
High-Performance Logic-on-Memory Monolithic 3-D IC Designs for Arm Cortex-A Processors. IEEE Trans. Very Large Scale Integr. Syst. 29(6): 1152-1163 (2021) - [c9]Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim:
Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options. DAC 2021: 1189-1194 - [c8]Lingjun Zhu, Tuan Ta, Rossana Liu, Rahul Mathur, Xiaoqing Xu, Shidhartha Das, Ankit Kaul, Alejandro Rico, Doug Joseph, Brian Cline, Sung Kyu Lim:
Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture. ISLPED 2021: 1-6 - [c7]Lingjun Zhu, Sung Kyu Lim:
Physical Design Challenges and Solutions for Emerging Heterogeneous 3D Integration Technologies. ISPD 2021: 127-134 - [c6]Jan Moritz Joseph, Ananda Samajdar, Lingjun Zhu, Rainer Leupers, Sung Kyu Lim, Thilo Pionteck, Tushar Krishna:
Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators. ISQED 2021: 60-66 - 2020
- [j3]Lingjun Zhu, Lennart Bamberg, Anthony Agnesina, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Julien Ryckaert, Alberto García-Ortiz, Sung Kyu Lim:
Heterogeneous 3D Integration for a RISC-V System With STT-MRAM. IEEE Comput. Archit. Lett. 19(1): 51-54 (2020) - [c5]Lingjun Zhu:
The Financial Archives Management System of University Based on Computer Network Technology. CSIA (2) 2020: 160-167 - [c4]Yi-Chen Lu, Sai Surya Kiran Pentapati, Lingjun Zhu, Kambiz Samadi, Sung Kyu Lim:
TP-GNN: A Graph Neural Network Framework for Tier Partitioning in Monolithic 3D ICs. DAC 2020: 1-6 - [c3]Lennart Bamberg, Alberto García Ortiz, Lingjun Zhu, Sai Pentapati, Da Eun Shim, Sung Kyu Lim:
Macro-3D: A Physical Design Methodology for Face-to-Face-Stacked Heterogeneous 3D ICs. DATE 2020: 37-42 - [c2]Lingjun Zhu, Kyungwook Chang, Dusan Petranovic, Saurabh Sinha, Yun Seop Yu, Sung Kyu Lim:
Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs. ISPD 2020: 39-46 - [c1]Yu Zhou, Chen Sun, Hongqiang Harry Liu, Rui Miao, Shi Bai, Bo Li, Zhilong Zheng, Lingjun Zhu, Zhen Shen, Yongqing Xi, Pengcheng Zhang, Dennis Cai, Ming Zhang, Mingwei Xu:
Flow Event Telemetry on Programmable Data Plane. SIGCOMM 2020: 76-89 - [i2]Fares Elsabbagh, Blaise Tine, Priyadarshini Roshan, Ethan Lyons, Euna Kim, Da Eun Shim, Lingjun Zhu, Sung Kyu Lim, Hyesoon Kim:
Vortex: OpenCL Compatible RISC-V GPGPU. CoRR abs/2002.12151 (2020) - [i1]Jan Moritz Joseph, Ananda Samajdar, Lingjun Zhu, Rainer Leupers, Sung Kyu Lim, Thilo Pionteck, Tushar Krishna:
Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators. CoRR abs/2012.12563 (2020)
2010 – 2019
- 2019
- [j2]Sai Pentapati, Lingjun Zhu, Lennart Bamberg, Da Eun Shim, Alberto García Ortiz, Sung Kyu Lim:
A Logic-on-Memory Processor-System Design With Monolithic 3-D Technology. IEEE Micro 39(6): 38-45 (2019) - 2013
- [j1]Huipeng Chen, Lingjun Zhu, Xiaofan Liu, Sunan Yu, Dingcheng Zhao:
Study on Steering by Wire Controller Based on Improved H∞ Algorithm. Int. J. Online Eng. 9(S2): 35-40 (2013)
Coauthor Index
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