research-article

Low-latency wireless 3D NoCs via randomized shortcut chips

Authors:

Hiroki Matsutani,

Michihiro Koibuchi,

Takahiro Kagami,

Tadahiro Kuroda,

Radu Marculescu,

Hideharu AmanoAuthors Info & Claims

DATE '14: Proceedings of the conference on Design, Automation & Test in Europe

Article No.: 273, Pages 1 - 6

Published: 24 March 2014 Publication History

Abstract

In this paper, we demonstrate that we can reduce the communication latency significantly by inserting a fraction of randomness into a wireless 3D NoC (where CMOS wireless links are used for vertical inter-chip communication) when considering the physical constraints of the 3D design space. Towards this end, we consider two cases, namely 1) replacing existing horizontal 2D links in a wireless 3D NoC with randomized shortcut NoC links and 2) enabling full connectivity by adding a randomized NoC layer to a wireless 3D platform with partial or no horizontal connectivity. Consequently, the packet routing is optimized by exploiting both the existing and the newly added random NoC. At the same time, by adding randomly wired shortcut NoCs to a wireless 3D platform, a good balance can be established between the modularity of the design and the minimum randomness needed to achieve low latency, and experimental results show that by adding a random NoC chip to wireless 3D CMPs without built-in horizontal connectivity, the communication latency can be reduced by as much as 26.2% when compared to adding a 2D mesh NoC. Also, the application execution time and average flit transfer energy can be improved accordingly.

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Cited By

Gade SAhmed MDeb SGanguly A(2019)Energy Efficient Chip-to-Chip Wireless Interconnection for Heterogeneous ArchitecturesACM Transactions on Design Automation of Electronic Systems10.1145/334010924:5(1-27)Online publication date: 26-Jul-2019
https://dl.acm.org/doi/10.1145/3340109
Koibuchi MLeong LTotoki TNiwa NMatsutani HAmano HCasanova H(2019)Sparse 3-D NoCs with Inductive CouplingProceedings of the 56th Annual Design Automation Conference 201910.1145/3316781.3317913(1-6)Online publication date: 2-Jun-2019
https://dl.acm.org/doi/10.1145/3316781.3317913
Nakao MMurai HSato M(2019)A Method for Order/Degree Problem Based on Graph Symmetry and Simulated Annealing with MPI/OpenMP ParallelizationProceedings of the International Conference on High Performance Computing in Asia-Pacific Region10.1145/3293320.3293325(128-137)Online publication date: 14-Jan-2019
https://dl.acm.org/doi/10.1145/3293320.3293325
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Index Terms

Low-latency wireless 3D NoCs via randomized shortcut chips
1. Hardware

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Information & Contributors

Information

Published In

cover image ACM Other conferences

DATE '14: Proceedings of the conference on Design, Automation & Test in Europe

March 2014

1959 pages

ISBN:9783981537024

General Chairs:
Gerhard Fettweis
TU Dresden, DE
,
Wolfgang Nebel
OFFIS, DE

Sponsors

EDAA: European Design Automation Association
ECSI
EDAC: Electronic Design Automation Consortium
IEEE Council on Electronic Design Automation (CEDA)
The Russian Academy of Sciences: The Russian Academy of Sciences

In-Cooperation

SIGDA: ACM Special Interest Group on Design Automation

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European Design and Automation Association

Leuven, Belgium

Publication History

Published: 24 March 2014

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DATE '14

Sponsor:

EDAA
EDAC
The Russian Academy of Sciences

DATE '14: Design, Automation and Test in Europe

March 24 - 28, 2014

Dresden, Germany

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Overall Acceptance Rate 518 of 1,794 submissions, 29%

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Cited By

Gade SAhmed MDeb SGanguly A(2019)Energy Efficient Chip-to-Chip Wireless Interconnection for Heterogeneous ArchitecturesACM Transactions on Design Automation of Electronic Systems10.1145/334010924:5(1-27)Online publication date: 26-Jul-2019
https://dl.acm.org/doi/10.1145/3340109
Koibuchi MLeong LTotoki TNiwa NMatsutani HAmano HCasanova H(2019)Sparse 3-D NoCs with Inductive CouplingProceedings of the 56th Annual Design Automation Conference 201910.1145/3316781.3317913(1-6)Online publication date: 2-Jun-2019
https://dl.acm.org/doi/10.1145/3316781.3317913
Nakao MMurai HSato M(2019)A Method for Order/Degree Problem Based on Graph Symmetry and Simulated Annealing with MPI/OpenMP ParallelizationProceedings of the International Conference on High Performance Computing in Asia-Pacific Region10.1145/3293320.3293325(128-137)Online publication date: 14-Jan-2019
https://dl.acm.org/doi/10.1145/3293320.3293325
Lee DDas SKim DDoppa JPande P(2018)Design Space Exploration of 3D Network-on-ChipACM Journal on Emerging Technologies in Computing Systems10.1145/319756714:3(1-26)Online publication date: 23-Oct-2018
https://dl.acm.org/doi/10.1145/3197567
Mohseni ZReshadi M(2018)A deadlock-free routing algorithm for irregular 3D network-on-chips with wireless linksThe Journal of Supercomputing10.1007/s11227-017-2173-974:2(953-969)Online publication date: 1-Feb-2018
https://dl.acm.org/doi/10.1007/s11227-017-2173-9
Nakahara HDoan NYasudo RAmano H(2017)XYZ-Randomization using TSVs for Low-Latency Energy Efficient 3D-NoCsProceedings of the Eleventh IEEE/ACM International Symposium on Networks-on-Chip10.1145/3130218.3130232(1-8)Online publication date: 19-Oct-2017
https://dl.acm.org/doi/10.1145/3130218.3130232
Gopal SDas SHeo DPande P(2017)Energy and Area Efficient Near Field Inductive CouplingProceedings of the Eleventh IEEE/ACM International Symposium on Networks-on-Chip10.1145/3130218.3130224(1-8)Online publication date: 19-Oct-2017
https://dl.acm.org/doi/10.1145/3130218.3130224
Chittamuru SDesai SPasricha S(2017)SWIFTNoCACM Journal on Emerging Technologies in Computing Systems10.1145/306051713:4(1-27)Online publication date: 29-Jun-2017
https://dl.acm.org/doi/10.1145/3060517
Kiani VReshadi M(2017)Mapping multiple applications onto 3D NoC-based MPSoCs supporting wireless linksThe Journal of Supercomputing10.1007/s11227-016-1908-373:5(2187-2213)Online publication date: 1-May-2017
https://dl.acm.org/doi/10.1007/s11227-016-1908-3
Das SDoppa JKim DPande PChakrabarty KMarculescu DLiu F(2015)Optimizing 3D NoC Design for Energy EfficiencyProceedings of the IEEE/ACM International Conference on Computer-Aided Design10.5555/2840819.2840917(705-712)Online publication date: 2-Nov-2015
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