Article

Performance analysis of carbon nanotube interconnects for VLSI applications

Authors:

K. BanerjeeAuthors Info & Claims

ICCAD '05: Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design

Pages 383 - 390

Published: 31 May 2005 Publication History

Abstract

The work in this paper analyses the applicability of carbon nanotube (CNT) bundles as interconnects for VLSI circuits, while taking into account the practical limitations in this technology. A model is developed to calculate equivalent circuit parameters for a CNT-bundle interconnect based on interconnect geometry. Using this model, the performance of CNT-bundle interconnects (at local, intermediate and global levels) is compared to copper wires of the future. It is shown that CNT bundles can outperform copper for long intermediate and global interconnects, and can be engineered to compete with copper for local level interconnects. The technological requirements necessary to make CNT bundles viable as future interconnects are also laid out.

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Cited By

Khurshid FSharma A(2019)Performance analysis of doped multi-layer graphene nanoribbon (MLGNR) interconnects at deep sub-micron nodesProceedings of the Third International Conference on Advanced Informatics for Computing Research10.1145/3339311.3339333(1-6)Online publication date: 15-Jun-2019
https://dl.acm.org/doi/10.1145/3339311.3339333
Kaur TRai MKhanna R(2019)Effect of temperature on the performance analysis of MLGNR interconnectsJournal of Computational Electronics10.1007/s10825-018-01297-w18:2(722-736)Online publication date: 1-Jun-2019
https://dl.acm.org/doi/10.1007/s10825-018-01297-w
Chittamuru SDesai SPasricha S(2017)SWIFTNoCACM Journal on Emerging Technologies in Computing Systems10.1145/306051713:4(1-27)Online publication date: 29-Jun-2017
https://dl.acm.org/doi/10.1145/3060517
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Performance analysis of carbon nanotube interconnects for VLSI applications
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cover image ACM Conferences

ICCAD '05: Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design

May 2005

1032 pages

ISBN:078039254X

Sponsors

SIGDA: ACM Special Interest Group on Design Automation

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IEEE Computer Society

United States

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Published: 31 May 2005

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Overall Acceptance Rate 457 of 1,762 submissions, 26%

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Cited By

Khurshid FSharma A(2019)Performance analysis of doped multi-layer graphene nanoribbon (MLGNR) interconnects at deep sub-micron nodesProceedings of the Third International Conference on Advanced Informatics for Computing Research10.1145/3339311.3339333(1-6)Online publication date: 15-Jun-2019
https://dl.acm.org/doi/10.1145/3339311.3339333
Kaur TRai MKhanna R(2019)Effect of temperature on the performance analysis of MLGNR interconnectsJournal of Computational Electronics10.1007/s10825-018-01297-w18:2(722-736)Online publication date: 1-Jun-2019
https://dl.acm.org/doi/10.1007/s10825-018-01297-w
Chittamuru SDesai SPasricha S(2017)SWIFTNoCACM Journal on Emerging Technologies in Computing Systems10.1145/306051713:4(1-27)Online publication date: 29-Jun-2017
https://dl.acm.org/doi/10.1145/3060517
Bagheri ARanjbar MHaji-Nasiri SMirzakuchaki S(2017)Modelling and analysis of crosstalk induced noise effects in bundle SWCNT interconnects and its impact on signal stabilityJournal of Computational Electronics10.1007/s10825-017-1028-116:3(845-855)Online publication date: 1-Sep-2017
https://dl.acm.org/doi/10.1007/s10825-017-1028-1
Mohsin KSrivastava AJones ALi HCoskun AMargala M(2015)Characterization of SWCNT Bundle Based VLSI Interconnect with Self-heating Induced ScatteringsProceedings of the 25th edition on Great Lakes Symposium on VLSI10.1145/2742060.2742074(265-270)Online publication date: 20-May-2015
https://dl.acm.org/doi/10.1145/2742060.2742074
Bobba SZhang JGaillardon PWong HMitra SMicheli G(2014)System Level Benchmarking with Yield-Enhanced Standard Cell Library for Carbon Nanotube VLSI CircuitsACM Journal on Emerging Technologies in Computing Systems10.1145/260007310:4(1-19)Online publication date: 2-Jun-2014
https://dl.acm.org/doi/10.1145/2600073
Bahirat SPasricha S(2014)METEORACM Transactions on Embedded Computing Systems10.1145/256794013:3s(1-33)Online publication date: 28-Mar-2014
https://dl.acm.org/doi/10.1145/2567940
Oh JZajic APrvulovic MFensch CO'Boyle MSeznec ABodin F(2013)Traffic steering between a low-latency unswitched TL ring and a high-throughput switched on-chip interconnectProceedings of the 22nd international conference on Parallel architectures and compilation techniques10.5555/2523721.2523764(309-318)Online publication date: 7-Oct-2013
https://dl.acm.org/doi/10.5555/2523721.2523764
Huang JZhu MYang SGupta PZhang WRubin SGarretón GHe J(2012)A physical design tool for carbon nanotube field-effect transistor circuitsACM Journal on Emerging Technologies in Computing Systems10.1145/2287696.22877088:3(1-20)Online publication date: 15-Aug-2012
https://dl.acm.org/doi/10.1145/2287696.2287708
Alam TDhiman RChandel RMishra B(2011)Resistive analysis of mixed carbon nanotube bundle interconnect and its comparison with copper interconnectProceedings of the International Conference & Workshop on Emerging Trends in Technology10.1145/1980022.1980271(1157-1160)Online publication date: 25-Feb-2011
https://dl.acm.org/doi/10.1145/1980022.1980271
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