I’m at DAC, The Chips to Systems Conference this week and we have a lot of exciting news coming out about our Siemens EDA portfolio, including the introduction of Calibre 3DThermal, an innovative software for thermal analysis, verification and debugging in 3D integrated circuits (3D-ICs). What excites me most about Calibre 3DThermal is that it integrates with a range of industry-leading design tools, including our existing EDA, Simcenter, and NX offerings: Calibre verification software, Calibre 3DSTACK software along with Simcenter Flotherm software solver engine. The tool can also be invoked through our new Innovator3D IC design cockpit, which was also launched at DAC. Calibre 3DThermal and Innovator3D IC collectively represent a significant leap forward in 3D-IC design, equipping designers with indispensable tools to navigate thermal challenges across the entire design lifecycle. Learn more: https://lnkd.in/gAgsKuvB
Tony Hemmelgarn’s Post
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Fan-out wafer-level packaging (FOWLP) design has many advantages and is one of the keys to the future of “More than Moore. FOWLP not only enables higher form factors, it also offers improved performance compared to traditional system-on-chip (SoC) designs. In this white paper entitled “Crossing the chasm: bringing SoC and package verification together with Calibre 3DSTACK” @Tarek Ramadan explains how designers can now apply die-level signoff verification to a wide variety of 2.5D and 3D stacked die assemblies, including FOWLP, to ensure manufacturability and performance. Click here to download - https://sie.ag/5xv8rt
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Fan-out wafer-level packaging (FOWLP) design has many advantages and is one of the keys to the future of “More than Moore. FOWLP not only enables higher form factors, it also offers improved performance compared to traditional system-on-chip (SoC) designs. In this white paper entitled “Crossing the chasm: bringing SoC and package verification together with Calibre 3DSTACK” @Tarek Ramadan explains how designers can now apply die-level signoff verification to a wide variety of 2.5D and 3D stacked die assemblies, including FOWLP, to ensure manufacturability and performance. Click here to download - https://sie.ag/5xv8rt
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Happy to share that I've successfully completed Cadence's in-depth course "Tempus Signoff Timing Analysis and Closure with Stylus Common UI" During this course, I delved deep into the features and capabilities of the Tempus™ Timing Signoff Solution and explored the attributes of the Stylus Common User Interface (CUI). Key takeaways include: - Understanding timing analysis data requirements and verifying design inputs - Exploring various timing analysis use models and operational modes in Tempus - Applying advanced timing debug techniques with the Global Timing Debug interface and executing manual ECOs - Integrating timing analysis with signal integrity (SI) considerations - Leveraging parallel processing techniques like Concurrent MMMC, Distributed MMMC, and Distributed STA - Conducting ECO analysis and achieving timing closure using Innovus™, Voltus™, and Tempus tools. This course has equipped me with essential skills and knowledge for efficient timing signoff and closure processes. Excited to apply these techniques in my future projects! #Cadence #Tempus #TimingAnalysis #STA #EDA #DesignClosure #SignalIntegrity #Innovus #Voltus #ContinuousLearning
Tempus Signoff Timing Analysis and Closure with Stylus Common UI v22.1 Exam was issued by Cadence Design Systems to Mohamed Shahid K.
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Siemens Industrial Automation Leader | Expert in Digital Solutions | Passionate about efficiency, sustainability and growth through tech. Proven in controls, strong customer ties. AA-ISP active member.
Fan-out wafer-level packaging (FOWLP) design has many advantages and is one of the keys to the future of “More than Moore. FOWLP not only enables higher form factors, it also offers improved performance compared to traditional system-on-chip (SoC) designs. In this white paper entitled “Crossing the chasm: bringing SoC and package verification together with Calibre 3DSTACK” @Tarek Ramadan explains how designers can now apply die-level signoff verification to a wide variety of 2.5D and 3D stacked die assemblies, including FOWLP, to ensure manufacturability and performance. Click here to download - https://sie.ag/2eNCxn
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Fan-out wafer-level packaging (FOWLP) design has many advantages and is one of the keys to the future of “More than Moore. FOWLP not only enables higher form factors, it also offers improved performance compared to traditional system-on-chip (SoC) designs. In this white paper entitled “Crossing the chasm: bringing SoC and package verification together with Calibre 3DSTACK” @Tarek Ramadan explains how designers can now apply die-level signoff verification to a wide variety of 2.5D and 3D stacked die assemblies, including FOWLP, to ensure manufacturability and performance. Click here to download - https://sie.ag/2eNCxn
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We are excited about how the Innovator3D IC design cockpit will streamline planning and heterogeneous integration of ASICs and chiplets!