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* Components can be placed on both sides of the circuit board.
* Higher density of connections because holes do not block routing space on inner layers, nor on back-side layers if components are mounted on only one side of the PCB.
* Small errors in component placement are corrected automatically as the surface tension of molten solder pulls components into alignment with solder pads. (On the other hand, through-hole components cannot be slightly misaligned
* Better mechanical performance under shock and vibration conditions (partly due to lower mass
* Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.
* Better [[Electromagnetic compatibility|EMC performance]] (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the lesser lead inductance.<ref name="MontroseEMC">{{cite book |last1=Montrose |first1=Mark I. |title=EMC and the Printed Circuit Board: Design, Theory, and Layout Made Simple |chapter=Components and EMC |publisher=[[John Wiley & Sons|Wiley-Interscience]] |year=1999 |page=64 |isbn=978-0780347038 }}</ref>
* Fewer holes need to be drilled. (Drilling PCBs is time-consuming and expensive.)
* Lower initial cost and time of setting up for mass production
* Simpler and faster
* Many SMT parts cost less than equivalent through-hole parts.
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