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IC bonding is also known as die bonding, die attach, and die mount.<ref name="Oricus Semicon Solutions 2021 z292">{{cite web | title=What is the Die Attach process? | website=Oricus Semicon Solutions | date=2021-11-01 | url=https://oricus-semicon.com/what-is-the-die-attach-process/ | access-date=2024-04-22}}</ref>
The following operations are performed at the packaging stage, as broken down into bonding, encapsulation, and wafer bonding steps. Note that this list is not all-inclusive and not all of these operations are performed for every package, as the process is highly dependent on the [[List of
*[[IC bonding]]
**[[Wire bonding]]
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