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Line 53: == Operations == After [[wafer dicing]], the die is picked from the diced wafer using a vaccum tip or suction cup<ref>Die Attachment, Fluid Dispensing catalog from SPT small precision tools</ref><ref>https://www.eetimes.com/die-bonding-techniques-and-methods/</ref> and undergoes ''~~Die~~die attachment'' which is the step during which a die is mounted and fixed to the [[Chip carrier\|package]] or support structure (header).<ref name="Turner762">L. W. Turner (ed), ''Electronics Engineers Reference Book'', Newnes-Butterworth, 1976, {{ISBN\|0-408-00168-2}}, pages 11-34 through 11-37</ref> For high-powered applications, the die is usually [[eutectic]] bonded onto the package, using e.g. gold-tin or gold-silicon [[solder]] (for good [[heat conduction]]). For low-cost, low-powered applications, the die is often glued directly onto a substrate (such as a [[printed wiring board]]) using an [[epoxy]] [[adhesive]]. The following operations are performed at the packaging stage, as broken down into bonding, encapsulation, and wafer bonding steps. Note that this list is not all-inclusive and not all of these operations are performed for every package, as the process is highly dependent on the [[List of integrated circuit packaging types\|package type]].

Integrated circuit packaging: Difference between revisions