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Line 2: {{about\|the final stage in the manufacturing process of integrated circuits\|an article about the physical enclosure that surrounds integrated circuits\|Semiconductor package }} {{Use American English\|date = March 2019}} [[File:DIP_package_sideview.PNG\|thumb\|Cross section of a [[dual in-line package]]. This type of package houses a small [[Die (integrated circuit)\|semiconducting die]], with microscopic wires attaching the die to the [[lead frame]]s, allowing for electrical connections to be made to a [[Printed circuit board\|PCB]].]] [[File:DIP zagotovka.jpg\|thumb\|Dual in-line (DIP) integrated circuit metal lead frame tape with contacts]] ~~In electronics manufacturing,~~ '''~~integrated~~Integrated circuit packaging''' is the final stage of [[Fabrication (semiconductor)\|semiconductor device fabrication]], in which the [[Die (integrated circuit)\|block of semiconductor material]] is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "[[Semiconductor package\|package]]", supports the electrical contacts which connect the device to a circuit board. In the [[integrated circuit]] industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.

Integrated circuit packaging: Difference between revisions