Content deleted Content added
KMaster888 (talk | contribs) ce |
KMaster888 (talk | contribs) add link |
||
| (2 intermediate revisions by the same user not shown) | |||
Line 60:
Finally, the boards are visually inspected for missing or misaligned components and solder bridging.<ref>{{Cite web |last=Ayodele |first=Abiola |title=SMT Manufacturing: Everything You Need to Know |url=https://www.wevolver.com/article/smt-manufacturing-everything-you-need-to-know |access-date=2022-09-30 |website=Wevolver}}</ref><ref>{{Cite web |title=PCB Manufacturer with HDI Circuit Board fabrication for PCB and PCBA |url=https://www.hemeixinpcb.com/ |access-date=2022-09-30 |website=www.hemeixinpcb.com}}</ref> If needed, they are sent to a [[#Rework|rework]] station where a human operator repairs any errors. They are then usually sent to the testing stations ([[in-circuit test]]ing and/or functional testing) to verify that they operate correctly.
[[Automated optical inspection]] (AOI) systems are commonly used in [[PCB manufacturing]]. This technology has proven highly efficient for process improvements and quality achievements.<ref>{{cite magazine|url=https://www.academia.edu/25794300|title=3D Solder Joint Reconstruction on SMD based on 2D Images|first=Pedro|last=Vitoriano|date=June 2016|magazine=SMT Magazine|pages=82–93}}</ref>
== Advantages ==
[[File:RC2010JK-071K2L.jpg|thumb|SMD resistors in original packaging - this packaging allows for use in a mounting machine]]
The main advantages of SMT over the through-hole technique are:<ref>{{Cite web |last=Das |first=Santosh |date=2019-10-01 |title=Surface Mount Technology Advantages and Disadvantages |url=http://www.electronicsandyou.com/blog/surface-mount-technology-advantages-and-disadvantages.html |access-date=2022-09-30 |website=Electronics Tutorial {{!}} The Best Electronics Tutorial Website |language=en-US}}</ref><ref>{{Cite web |last=Team |first=VSE {{!}} Engineering |date=2020-05-07 |title=Surface Mount Technology Advantages and Disadvantages for PCB Assembly |url=https://www.vse.com/blog/2020/05/07/surface-mount-technology-advantages-and-disadvantages-for-pcb-assembly/ |access-date=2022-09-30 |website=VSE |language=en-US}}</ref>
*
* Smaller components.▼
* Much higher component density (components per unit area) and many more connections per component.
* Components can be placed on both sides of the circuit board.
Line 75:
* Fewer holes need to be drilled. (Drilling PCBs is time-consuming and expensive.)
* Lower initial cost and time of setting up for mass production using automated equipment.
▲* Simpler and faster-automated assembly. Some placement machines are capable of placing more than 136,000 components per hour.
* Many SMT parts cost less than equivalent through-hole parts.
▲* Smaller components.
== Disadvantages ==
| |||